Laser shock processed pilger dies

Abstract

A pilger die construction having a laser shock processed area. The processed area includes at least one of the following pilger die locations: the taper, the flank, the sizing area, the tread, the groove. A method of laser shock processing a pilger die by controlling the application of a transparent overlay on the surface of the pilger die is also disclosed.

1 . A pilger die having a laser shock processed area. 
   
   
       2 . The pilger die of  claim 1 , in which said processed area includes at least one of the following pilger die locations: the taper, the flank, the sizing area, the tread, the groove. 
   
   
       3 . The pilger die of  claim 2  in which said processed area group is minimized to that only those needed for effective pilger lifetime extension. 
   
   
       3 . A method of laser shock processing a pilger die by controlling the application of a transparent overlay on the surface of the pilger die to reduce the variability of shock waves generated therein, comprising:
 applying a transparent overlay material over said surface of said pilger die;   measuring the thickness of said transparent overlay in at least one location on said transparent overlay;   determining if said measured value for said overlay is within the specified range; and   directing a pulse of coherent energy to said pilger die to create a shock wave therein when said measured value is within the specified range.