Microelectromechanical capacitor based device

Abstract

A system and methods of a microelectromechanical capacitor based device are disclosed. In one embodiment, a system of a microelectromechanical capacitive device includes a housing formed when a nonconductive material is deposited on a substrate, and a conductive plate mechanically coupled to the housing. The system further includes an additional housing coupled to the housing and an additional conductive plate that is substantially parallel to the conductive plate. The additional conductive plate is coupled to the additional conductive plate. The additional housing may be formed when an additional nonconductive material is deposited on an additional substrate. The substrate and the additional substrate may be dissolved using a chemical etching process when the housing and the additional housing are coupled.

1 . A system of a microelectromechanical capacitive device, comprising:
 a housing formed when a nonconductive material is deposited on a substrate;   a conductive plate mechanically coupled to the housing;   an additional housing coupled to the housing; and   an additional conductive plate that is substantially parallel to the conductive plate, wherein the additional conductive plate is coupled to the additional conductive plate.   
     
     
         2 . The system of  claim 1 , wherein the additional housing is formed when an additional nonconductive material is deposited on an additional substrate. 
     
     
         3 . The system of  claim 1 , wherein the substrate and the additional substrate are dissolved using a chemical etching process when the housing and the additional housing are coupled. 
     
     
         4 . The system of  claim 1 , wherein the microelectromechanical capacitive device is used to detect a change in capacitance when a gap between the conductive plate and the additional conductive plate is changed. 
     
     
         5 . The system of  claim 1 , wherein the microelectromechanical capacitive device is used to detect a change in capacitance when an overlapping area of the conductive plate and of the additional conductive plate is changed. 
     
     
         6 . The microelectromechanical capacitive device of  claim 4 , further comprising a supplementary pair of conductive plates, wherein the microelectromechanical capacitive device is used to detect a change in capacitance when an overlapping area of the supplementary pair of conductive plates is changed. 
     
     
         7 . The system of  claim 1 , further comprising a reference sensor coupled to the housing to generate a capacitance based on an environmental factor and to compensate a measurement affected by the environmental factor. 
     
     
         8 . The system of  claim 1 , further comprising a plurality of capacitors in the housing, wherein a difference in capacitance between the plurality of capacitors is used to detect an uneven force when it is applied to the housing. 
     
     
         9 . The system of  claim 1 , further comprising at least one of a semisolid and a solid dielectric material located between the conductive plate and the additional conductive plate. 
     
     
         10 . The system of  claim 1 , further comprising a tip of a catheter that is mechanically coupled to the housing, wherein the system detects a force when it is applied to the tip of the catheter and it causes an additional force to act on the housing. 
     
     
         11 . The system of  claim 1 , further comprising a container coupled to the housing. 
     
     
         12 . The system of  claim 11 , wherein the container holds a medicine, and wherein a weight of the medicine is determined by a capacitance between the conductive plate and the additional conductive plate when a force is applied to the housing. 
     
     
         13 . The system of  claim 1 , further comprising:
 a tire physically coupled to the housing;
 a measurement module to obtain a tire pressure measurement when a force is applied to the housing, wherein the measurement module is electrically coupled to the conductive plate and the additional conductive plate; 
   a communication module, wherein the communication module is used to communicate the tire pressure measurement when a force is applied to the housing; and   an energy harvesting module, wherein the energy harvesting module acquires a kinetic energy of the tire when the tire is moving, stores the kinetic energy, and powers the measurement module when it obtains the tire pressure measurement.   
     
     
         14 . The system of  claim 13 , wherein the tire pressure measurement is communicated using at least one of wireless universal serial bus, Wi-Fi, Bluetooth, and Zigbee. 
     
     
         15 . A method of a microelectromechanical capacitive device, comprising:
 depositing a nonconductive material on a substrate to form a housing;   depositing an additional nonconductive material on an additional substrate to form an additional housing;   mechanically coupling a conductive plate to the housing;   mechanically coupling an additional conductive plate to the additional housing; and   forming the microelectromechanical device, wherein the microelectromechanical device is formed when the housing and the additional housing are mechanically coupled such that the conductive plate and the additional conductive plate are substantially parallel.   
     
     
         16 . The method of  claim 15 , further comprising dissolving the substrate and the additional substrate using a chemical etching process. 
     
     
         17 . The method of  claim 15 , wherein the microelectromechanical capacitive device is used to detect a change in capacitance when a gap between the conductive plate and the additional conductive plate is changed. 
     
     
         18 . The method of  claim 15 , wherein the microelectromechanical capacitive device is used to detect a change in capacitance when an overlapping area of the conductive plate and of the additional conductive plate is changed. 
     
     
         19 . A method of a microelectromechanical capacitive device, comprising:
 receiving an applied force with a housing formed when a nonconductive material is deposited on a substrate;   deflecting the housing in response to the applied force;
 shifting the conductive plate coupled to the housing relative to an additional conductive plate using the deflection of the housing, wherein the additional conductive plate is mechanically coupled to an additional housing; and 
   detecting a change in capacitance using a change of at least one of a gap between the conductive plate and the additional conductive plate and an overlapping area of the conductive plate and the additional conductive plate.   
     
     
         20 . The method of  claim 19 , further comprising:
 detecting a capacitance based on an environmental factor using a reference sensor in the housing; and   compensating a measurement affected by the environmental factor.