Detection apparatus for biological materials and methods of making and using the same
Abstract
Apparatus comprising a surface site comprising a substantially inorganic surface having a chemical composition selected from the group consisting of metals, semiconductors, insulators, and mixtures thereof, the surface positioned within a polypeptide bonding region and having a selective bonding affinity for a polypeptide; a plurality of interlayers between which the surface site is interposed; a distal site end on the surface site and distanced from the interlayers, the surface being provided on the distal site end; the surface site and the interlayers being interposed between first and second supports; first and second conductors provided on the first and second supports and having respective first and second distal conductor ends positioned within the polypeptide bonding region; the conductors being capable of applying an external voltage potential across the polypeptide bonding region. Apparatus, optionally comprising such first and second supports and conductors; and comprising a third conductor in electrical communication with the surface site, the third conductor positioned for electrical communication with a source of an external bias voltage. Techniques for making apparatus.
Claims
exact text as granted — not AI-modified1 - 5 . (canceled)
6 . An apparatus, comprising:
a first surface site comprising a first substantially inorganic surface having a first chemical composition selected from the group consisting of metals, semiconductors, insulators, and mixtures thereof, said first surface positioned within a polypeptide bonding region and having a selective bonding affinity for a polypeptide; a plurality of first interlayers between which said first surface site is interposed; a first distal site end on said first surface site and distanced from said first interlayers, said first surface being provided on said first distal site end; and a first conductor in electrical communication with said first surface site, said first conductor positioned for electrical communication with a source of an external bias voltage; said first surface site having a charge carrier mobility.
7 . The apparatus of claim 6 , further comprising:
a second surface site comprising a second substantially inorganic surface having a second chemical composition selected from the group consisting of metals, semiconductors, insulators, and mixtures thereof, said second surface positioned within a polypeptide bonding region and having a selective bonding affinity for a polypeptide; a plurality of second interlayers between which said second surface site is interposed; a second distal site end on said second surface site and distanced from said second interlayers, said second surface being provided on said second distal site end; a second conductor in electrical communication with said second surface site, said second conductor positioned for electrical communication with a source of an external bias voltage; said second surface site having a charge carrier mobility.
8 . The apparatus of claim 7 , further comprising:
a substrate formed from an electrically insulating composition, said substrate comprising said first and second interlayers; a first comb on said substrate comprising said first surface site, said first comb comprising first tines formed from said first chemical composition; a second comb on said substrate comprising said second surface site, said second comb comprising second tines formed from said second chemical composition; said first and second combs positioned on said substrate with their respective tines placed in mutually interwoven relationships at a spaced apart distance; said distance being suitable for traversal by polypeptides.
9 . The apparatus of claim 6 , in which said first chemical composition comprises a metal selected from the group consisting of: palladium, gold, titanium, platinum, aluminum, magnesium, calcium, zirconium, vanadium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, silver, zinc, cadmium, gallium, indium, thalium, tin, lead, and mixtures thereof.
10 . The apparatus of claim 6 , in which said first chemical composition comprises a semiconductor selected from the group consisting of: gallium arsenide, aluminum gallium arsenide, indium phosphide, indium gallium arsenide, indium gallium phosphide, indium gallium arsenide phosphide, indium aluminum gallium arsenide, gallium nitride, indium nitride, aluminum nitride, aluminum gallium nitride, indium aluminum gallium nitride, gallium antimonide, indium antimonide, aluminum antimonide, aluminum gallium antimonide, indium aluminum gallium antimonide, indium arsenic antimonide, gallium aluminum antimonide, indium gallium antimonide, gallium arsenic antimonide, and mixtures thereof.
11 . The apparatus of claim 6 , in which said first chemical composition comprises a metallic insulator composition selected from the group consisting of: oxides, carbides, borides, nitrides, sulfides, and mixtures thereof.
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