Refrigeration Condenser for Electronics Cooling and Manufacture Thereof

Abstract

Embodiments disclosed herein include a condenser stack having a cross-flow plate with a plurality of transverse slots, and first and second microchannel plates mounted to the cross-flow plate. In some embodiments, the microchannel plates may have a plurality of microchannels that allow for the flow of the refrigerant substantially through the plurality of microchannels in a direction generally perpendicular to the plurality of transverse slots. In some embodiments, the condenser stack may be implemented in an apparatus, such as a heat sink assembly, and in a refrigerator system. Moreover, embodiments for a method for manufacturing the condenser stack and apparatus are described. Other embodiments are also described.

1 . A condenser stack, comprising:
 a cross-flow plate having an upper side and a lower side, and further having a plurality of transverse slots extending substantially through the medial plane of the cross-flow plate to increase uniformity of a flow of a refrigerant;   a first microchannel plate mounted to the upper side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having an upper external surface; and   a second microchannel plate mounted to the lower side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having a lower external surface, wherein a cavity is formed within the first and second microchannel plates to allow for the flow of the refrigerant substantially through the plurality of microchannels in a direction generally perpendicular to the plurality of transverse slots.   
   
   
       2 . The condenser stack of  claim 1 , wherein the first microchannel plate and the second microchannel plate are brazed to the cross-flow plate. 
   
   
       3 . The condenser stack of  claim 1 , wherein one or more of the cross-flow plate, the first microchannel plate, or the second microchannel plate is formed substantially of aluminum, copper, or steel. 
   
   
       4 . The condenser stack of  claim 1 , wherein the cross-flow plate is about one millimeter thick, and the first microchannel plate and the second microchannel plate are each about two millimeters thick. 
   
   
       5 . The condenser stack of  claim 1 , wherein one or more of the cross-flow plate, the first microchannel plate, or the second microchannel plate is formed substantially by one or more of extrusion, stamping, folding, bonding, machining, forging, molding, or cutting. 
   
   
       6 . The condenser stack of  claim 1 , wherein the mounted microchannel plates form one or more lateral openings at each end of the condenser stack. 
   
   
       7 . An apparatus, comprising:
 a cross-flow plate having an upper side and a lower side, and further having a plurality of transverse slots extending substantially through the medial plane of the cross-flow plate to increase uniformity of a flow of a refrigerant;   a first microchannel plate mounted to the upper side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having an upper external surface;   a second microchannel plate mounted to the lower side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having a lower external surface, wherein a cavity is formed within the first and second microchannel plates to allow for the flow of the refrigerant substantially through the plurality of microchannels in a direction generally perpendicular to the plurality of transverse slots; and   a first heat sink to transfer thermal energy and mounted to at least one of the first microchannel plate or the second microchannel plate.   
   
   
       8 . The apparatus of  claim 7 , further comprising:
 a second heat sink to transfer thermal energy and mounted to the other one of the first or the second microchannel plate than the plate on which the first heat sink is mounted.   
   
   
       9 . The apparatus of  claim 8 , wherein one or more of the first or the second heat sink is soldered to the at least one of the first or the second microchannel plate. 
   
   
       10 . The apparatus of  claim 7 , wherein either the first or the second heat sink is a fin array, a fin-pin array, a bar shape, or an angled shape. 
   
   
       11 . The apparatus of  claim 7 , wherein one or more of the cross-flow plate, the first or the second microchannel plate, or the first or the second heat sink is formed substantially of aluminum, copper, or steel. 
   
   
       12 . The apparatus of  claim 7 , wherein one or more of the cross-flow plate, the first or the second microchannel plate, or the first or the second heat sink is formed substantially by one or more of extrusion, stamping, folding, bonding, machining, forging, molding, or cutting. 
   
   
       13 . A system, comprising:
 an evaporator to receive thermal energy from a component and to transfer a portion of the thermal energy to a refrigerant, wherein the refrigerant is conducted via pressure through tubing coupled the evaporator;   a compressor coupled via the tubing to the evaporator and capable of increasing the pressure on the refrigerant and capable of pumping it through the tubing;   an apparatus to operate as a condenser coupled via the tubing to the compressor, wherein the apparatus includes a cross-flow plate having an upper side and a lower side, and further having a plurality of transverse slots extending substantially through the medial plane of the cross-flow plate to increase uniformity of a flow of a refrigerant;   a first microchannel plate mounted to the upper side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having an upper external surface; and   a second microchannel plate mounted to the lower side of the cross-flow plate, and having a plurality of microchannels along a medial plane, and further having a lower external surface, wherein a cavity is formed within the first and second microchannel plates to allow for the flow of the refrigerant substantially through the plurality of microchannels in a direction generally perpendicular to the plurality of transverse slots, and wherein the mounted microchannel plates form one or more lateral openings at each end of the plates, and a first heat sink to transfer thermal energy and mounted to at least one of the first microchannel plate or the second microchannel plate, wherein a portion of the thermal energy is capable of being transferred from the refrigerant to the heat sink; and   a throttling device coupled via the tubing to the apparatus and capable of restricting the flow of the refrigerant to reduce the pressure within the tubing, wherein the throttling device is coupled to the evaporator via the tubing and is capable of allowing the refrigerant to flow via the tubing to the evaporator.   
   
   
       14 . The system of  claim 13 , wherein the component includes an electronic component, a cold plate, a heat exchanger or a fan. 
   
   
       15 . The system of  claim 14 , wherein the electronic component is a central processing unit (CPU), a processor, a core, a chipset, or a memory.