Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores

Abstract

A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a multilayer backlight module is arranged on one side surface of the metallic panel via a hot pressing or adhering process. Finally, a telecommunication module is adhered on one side surface of the backlight module. In this way, the metallic panel having multilayer arrays of micropores can be completed.

1 . A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:
 (a) preparing a metallic thin plate;   (b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;   (c) cutting the metallic thin plate to form a metallic panel of a predetermined shape; and   (d) adhering a multilayer backlight module on one side surface of the metallic panel.   
   
   
       2 . The method according to  claim 1 , wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy. 
   
   
       3 . The method according to  claim 1 , wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body. 
   
   
       4 . The method according to  claim 1 , wherein the pattern formed in the step (b) is formed on a key body. 
   
   
       5 . The method according to  claim 1 , wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols. 
   
   
       6 . The method according to  claim 1 , wherein filler is filled in the micropores prior to performing the step (c). 
   
   
       7 . The method according to  claim 6 , wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin. 
   
   
       8 . The method according to  claim 1 , wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, and the first and second light-guiding microstructures are arranged alternatively on the key body. 
   
   
       9 . The method according to  claim 8 , wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively. 
   
   
       10 . The method according to  claim 8 , wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors. 
   
   
       11 . The method according to  claim 8 , wherein the first and second light-guiding microstructures on the first and second light-guiding plates are recessed in or protrude from one side surface of the first and second light-guiding plates. 
   
   
       12 . A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:
 (a) preparing a metallic thin plate;   (b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;   (c) cutting the metallic thin plate to form a metallic panel of a predetermined shape;   (d) adhering a multilayer backlight module on one side surface of the metallic panel; and   (e) adhering a telecommunication module on one side surface of the multilayer backlight module.   
   
   
       13 . The method according to  claim 12 , wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy. 
   
   
       14 . The method according to  claim 12 , wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body. 
   
   
       15 . The method according to  claim 12 , wherein the pattern formed in the step (b) is formed on a key body. 
   
   
       16 . The method according to  claim 12 , wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols. 
   
   
       17 . The method according to  claim 12 , wherein a filler is filled in the micropores prior to performing the step (c). 
   
   
       18 . The method according to  claim 17 , wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin. 
   
   
       19 . The method according to  claim 12 , wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, the first and second light-guiding microstructures are arranged alternatively on the key body. 
   
   
       20 . The method according to  claim 19 , wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively. 
   
   
       21 . The method according to  claim 20 , wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors. 
   
   
       22 . The method according to  claim 19 , wherein the light-guiding microstructures on the two light-guiding plates are recessed in or protrude from one side surface of the light-guiding plates. 
   
   
       23 . The method according to  claim 12 , wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome, a protrusion is provided on one side surface of a protruding portion of the film layer. 
   
   
       24 . The method according to  claim 13 , wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome.