Laminate

Abstract

A laminate prepared by pretreating at least one side of a substrate of a plastic film by plasma treatment and then directly laminating a thermoplastic resin on a surface treated by pretreatment.

1 . A laminate prepared by pretreating at least one side of a substrate of a plastic film by plasma treatment and then directly laminating a thermoplastic resin on a surface treated by pretreatment. 
   
   
       2 . The laminate according to  claim 1 , wherein the substrate comprises a plastic film provided on one side thereof with a deposited layer. 
   
   
       3 . The laminate according to  claim 1 , wherein the surface of the substrate is further provided with a gas barrier coating layer. 
   
   
       4 . The laminate according to  claim 1 , wherein, when peeling of the substrate and the thermoplastic resin layer is performed while penetrating water, the treated surface of the substrate is peeled through cohesion failure. 
   
   
       5 . The laminate according to  claim 1 , wherein the plasma treatment is a treatment by reactive ion etching (RIE) which is a treatment with low-temperature plasma where a self-bias value is set to 200 V or more to 2000 V or less and an Ed value defined by Ed=(plasma density)×(treatment time) is set to 100 W·m −2 ·s or more to 10000 W·m −2 ·s or less. 
   
   
       6 . The laminate according to  claim 1 , wherein the thermoplastic resin contains one or more resins selected from the group consisting of a low-density polyethylene resin, a high-density polyethylene resin, a medium-density polyethylene resin, an ethylene-vinyl acetate copolymer, an ethylene-α-olefin copolymer, an ethylene-α,β-unsaturated carboxylic acid copolymer and its esterified product or ionic crosslinked product thereof, a polypropylene resin, a propylene-α-olefin copolymer, an acid anhydride-modified polyolefin, and an epoxy-modified polyolefin. 
   
   
       7 . The laminate according to  claim 1 , wherein the substrate is formed of a polyethylene terephthalate film, and when a surface of the polyethylene terephthalate film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, an element ratio (O/C) is 0.49 or less. 
   
   
       8 . The laminate according to  claim 1 , wherein the substrate is formed of a polyethylene terephthalate film, and when a surface of the polyethylene terephthalate film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, a functional group ratio (COO/C—C) as determined by analysis of C1s waveform is 0.33 or less. 
   
   
       9 . The laminate according to  claim 1 , wherein the substrate is formed of a polyethylene terephthalate film, and when a surface of the polyethylene terephthalate film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, a half width of C—C bond as determined by analysis of C1s waveform is 1.340 to 1.560 eV. 
   
   
       10 . The laminate according to  claim 1 , wherein the substrate is formed of a polyamide film, and when a surface of the polyamide film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, an element ratio (O/(C+N)) is 0.2 or more. 
   
   
       11 . The laminate according to  claim 1 , wherein the substrate is formed of a polyamide film, and when a surface of the polyamide film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, a half width of C—C bond as determined by analysis of C1s waveform is 1.380 to 1.560 eV. 
   
   
       12 . The laminate according to  claim 1 , wherein the substrate is formed of a polypropylene film, and when a surface of the polypropylene film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, an element ratio (O/C) is 0.03 to 0.135. 
   
   
       13 . The laminate according to  claim 1 , wherein the substrate is formed of a polypropylene film, and when a surface of the polypropylene film after pretreatment by reactive ion etching is measured by X-ray photoelectron spectroscopy under conditions of an X-ray source of MgKα and an output power of 100 W, a half width of C—C bond as determined by analysis of C1s waveform is 1.320 to 1.600 eV. 
   
   
       14 . The laminate according to  claim 3 , wherein a surface of the gas barrier coating layer is subjected to pretreatment by plasma treatment. 
   
   
       15 . The laminate according to  claim 14 , wherein the gas barrier coating layer is a gas barrier coating layer containing a water-soluble polymer or a water-soluble polymer and an inorganic compound. 
   
   
       16 . The laminate according to  claim 14 , wherein, when a surface of the gas barrier coating layer is measured by X-ray photoelectron spectroscopy (XPS), a functional group ratio D (C—OH/C—C) of a carbon-hydroxyl group bond (C—OH) to a carbon-carbon bond (C—C) in a water-soluble polymer is 0.25 or more to 0.87 or less. 
   
   
       17 . The laminate according to  claim 15 , wherein the water-soluble polymer is polyvinyl alcohol. 
   
   
       18 . The laminate according to  claim 15 , wherein the inorganic compound is a hydrolysis product of at least one metal alkoxide. 
   
   
       19 . The laminate according to  claim 14 , wherein a deposited layer of an inorganic oxide with a thickness of 5 to 100 nm is disposed between a substrate body and the gas barrier coating layer. 
   
   
       20 . The laminate according to  claim 14 , wherein a ratio D/D 0  of a functional group ratio D of the gas barrier coating layer after pretreatment to a functional group ratio D 0  thereof before pretreatment is 0.30 or more to 0.92 or less.