Wafer cassette

Abstract

A wafer cassette. At least one support bar includes a composite curved holding portion. Multiple separation plates are connected to the composite curved holding portion and are parallel to and separated from each other.

1 . A wafer cassette, comprising:
 at least one support bar comprising a composite curved holding portion; and   a plurality of separation plates connected to the composite curved holding portion and parallel to and separated from each other.   
     
     
         2 . The wafer cassette as claimed in  claim 1 , wherein the composite curved holding portion comprises a first curved surface, a second curved surface, and a third curved surface, and the second curved surface connects the first curved surface to the third curved surface. 
     
     
         3 . The wafer cassette as claimed in  claim 2 , wherein the direction of curvature of the second curved surface is opposite to that of the first curved surface, and the direction of curvature of the third curved surface is the same as that of the first curved surface. 
     
     
         4 . The wafer cassette as claimed in  claim 2 , wherein the first, second, and third curved surfaces comprise a plurality of round surfaces, respectively.