Thin-film assembly and method for producing said assembly

Abstract

A thin-film assembly ( 1 ) including a substrate ( 2 ) and at least one electronic thin-film component ( 8 ) applied on the substrate by thin-film technology, wherein a base electrode ( 4 ) is provided on the substrate, on which base electrode thin-film layers ( 21 ) forming part of the thin-film component are arranged together with an upper top electrode ( 9 ); the substrate ( 2 ) is comprised of a printed circuit board ( 2 ) known per se and including an insulation-material base body ( 3 ) and a metal coating as the conductor layer ( 5 ), wherein the conductor layer ( 5 ) forms the base electrode ( 4 ) and, to this end, is smoothed at least on the location of the thin-film component ( 8 ), and wherein a contact layer ( 18 ) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer ( 5 ) and the superimposed thin-film layers ( 21 ) of the thin-film component ( 8 ), which contact layer is physically or chemically adsorbed on the surface of the base electrode ( 4 ).

1 . A method for for producing a thin-film assembly including at least one electronic thin-film component which is applied on a substrate by thin-film technology, characterized in that a printed circuit board with an insulation-material base body and a metal coating as the conductor layer is used, that the conductor layer is at least locally smoothed, optionally upon attachment of a reinforcement, in order to form at least one base electrode for the thin-film component, and that a contact layer is applied on the base electrode by thin-film technology prior to attaching the remaining thin-film component thereabove. 
     
     
         2 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by a mechanical method such as, e.g., lapping, grinding or polishing. 
     
     
         3 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by electrochemical polishing. 
     
     
         4 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by chemicomechanical polishing. 
     
     
         5 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by chemical etching using, for instance, sulfuric acid, nitric acid or chromosulfuric acid. 
     
     
         6 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by ion etching. 
     
     
         7 . A method according to  claim 1 , characterized in that the conductor layer is smoothed by bombardment with particles of individual or several atoms or molecules, such as, e.g, argon or argon clusters. 
     
     
         8 . A method according to  claim 1 , characterized in that the conductor layer is smoothed over surface areas having the dimensions of 20×20 μm 2  to a maximum mean surface roughness of 10 nm and, preferably, 3 nm. 
     
     
         9 . A method according to  claim 1 , characterized in that the conductor layer is electrochemically reinforced. 
     
     
         10 . A method according to  claim 1 , characterized in that the printed circuit board is temporarily passivated by photolitography in the remaining areas prior to locally reinforcing the conductor layer. 
     
     
         11 . A method according to  1 , characterized in that base body areas uncovered from the conductor layer are passivated by photolitographically assisted thin-film technology prior to attaching the remaining thin-film component. 
     
     
         12 . A method according to  10 , characterized in that a passivation layer is applied by thermal evaporation. 
     
     
         13 . A method according to  10 , characterized in that a passivation layer is applied by cold cathode coating. 
     
     
         14 . A method according to  1 , characterized in that a flexible printed circuit board is used as said substrate. 
     
     
         15 . A method according to  14 , characterized in that the flexible printed circuit board is temporarily supported, at least during smoothing, by a stiffened layer and/or by being guided over a table. 
     
     
         16 . A method according to  1 , characterized in that a flexible printed circuit board sheeting unwound from a reel is used. 
     
     
         17 . A method according to  14 , characterized in that a prefabricated flexible encapsulation sheeting is applied above the flexible printed circuit board sheeting provided with the thin-film component. 
     
     
         18 . A method according to  17 , characterized in that the encapsulation sheeting is unwound from a reel.