Machining Tool and Method For The Production Thereof
Abstract
The invention relates to a machining tool having a determined or non-determined cut and to a method for the production thereof. The tool is provided with a hard metal substrate ( 10 ). A diamond or DLC layer ( 12 ) is applied to the substrate ( 10 ). Several edges ( 16 ) are formed by abrupt alteration of layer thickness in the surface of the diamond or DLC layer ( 12 ). The diamond or DLC layer is applied using a CVD method. The diamond layer is applied using a CVD method and the DLC layer is applied using a PVD or CVD method. A mask ( 14 ) is applied to the layer. The edges ( 16 ) are produced by etching points on the surface that are not covered by the mask. As a result, it is possible to significantly increase the functionality of the tool. The edges ( 16 ) can be used as additional cutting edges or free areas can be transformed for discharging coolants or lubricants and removed material.
Claims
exact text as granted — not AI-modified1 . Tool for machining with a determined or non-determined cut with
a hard metal substrate and a diamond or DLC layer on the substrate wherein several edges formed through the abrupt transition of the layer thickness are present in the surface of the diamond or DLC layer.
2 . Tool according to claim 1 , in which
at least one deeper lying area is provided in the surface of the diamond or DLC layer for discharging removed material and/or coolant or lubricant.
3 . Tool according to claim 1 , in which
several protruding islands are formed on the surface of the diamond or DLC layer.
4 . Tool according to claim 1 , in which
the tool is an abrasive tool.
5 . Tool according to claim 1 , in which
the tool has a pin shape.
6 . Tool according to claim 1 , in which
the tool is a machining tool with a determined cut.
7 . Tool according to claim 6 , in which
the blade has a chip surface, wherein the diamond or DLC layer is deposited at least on parts of the chip surface, wherein structures for breaking or guiding a chip are provided on the surface of the diamond or DLC layer on the chip surface.
8 . Tool according to claim 6 , in which
the tool is an indexable insert.
9 . Tool according to claim 1 , in which
the diamond or DLC layer comprises at least a first layer and a second layer deposited at least to parts thereof.
10 . Tool according to claim 1 , in which
a label or marking ( 62 ) is formed by the edges ( 16 ) introduced in the surface of the diamond or DLC layer ( 21 , 22 ).
11 . Method for the production of a tool with a determined or non-determined cut, in which
a diamond or DLC layer is deposited to a hard metal substrate, a mask is applied to the diamond or DLC layer, and the diamond or DLC layer on the spots without the mask is entirely or partially removed through etching so that several edges of the diamond or DLC layer are created on the surface of the tool.
12 . Method according to claim 11 , in which
the diamond or DLC layer is etched in an oxygen-containing plasma.
13 . Method according to claim 11 , in which
the substrate is not etched during the etching.
14 . Method according to claim 11 , in which
the diamond or DLC layer is deposited in a hot filament/CVD procedure.
15 . Method according to claim 11 , in which
the diamond or DLC layer on the areas with the mask is completely removed. and another diamond or DLC layer is subsequently deposited to the surface of the tool.
16 . Tool according to claim 7 , in which
the tool is an indexable insert.Join the waitlist — get patent alerts
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