Method of cutting material for use in implantable medical device
Abstract
A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.
Claims
exact text as granted — not AI-modified1 . An apparatus for cutting a prosthetic segment, the apparatus comprising:
a source material segment; a support platform supporting the source material segment; a beam assembly positioned to direct a beam at the source material segment; and a motion system that controls the relative position of the support platform and the beam.
2 . The apparatus of claim 1 further comprising an electronic mechanism that changes the relative position of the support platform and the beam.
3 . The apparatus of claim 2 wherein the motion system actuates the electronic mechanism to adjust the relative position of the laser beam.
4 . The apparatus of claim 2 wherein the electronic mechanism is connected to the laser beam to move the laser beam relative to the support platform.
5 . The apparatus of claim 1 wherein the motion system comprises a digital processor connected to the electronic mechanism, wherein the motion system controls the electronic mechanism with a printer driver.
6 . The apparatus of claim 1 wherein the digital processor further comprises cutting patterns.
7 . The apparatus of claim 5 wherein the digital processor further comprises a computer assisted design software program.
8 . The apparatus of claim 7 wherein the computer assisted design software program further comprises a template.
9 . The apparatus of claim 1 wherein the laser tube assembly further comprises optical elements within the laser tube assembly to direct a focused laser beam on the support platform, and wherein the motion system is operably connected to the optical components to move the optical components relative to the support platform.
10 . The apparatus of claim 9 wherein the optical components further comprises lenses.
11 . The apparatus of claim 10 wherein the optical components further comprises mirrors.
12 . The apparatus of claim 1 wherein the source material segment further being of equine pericardium.
13 . The apparatus of claim 1 wherein the beam assembly further comprises a laser.
14 . The apparatus of claim 13 wherein the laser is operated in a pulsed manner, supplying between about 0.005-0.5 joules of laser energy per pulse, with a laser spot size of about 0.002-0.005 inches in diameter.
15 . The apparatus of claim 13 wherein the laser is operated at a cutting speed of about 1 inch per second and a pulse rate of about 1000 pulses per inch.
16 . The apparatus of claim 13 , wherein the laser beam operates at a wavelength of about 10.6 microns.
17 . The apparatus of claim 13 , wherein the laser beam operates at a wavelength of about 2.7-3.0 microns.
18 . The apparatus of claim 13 , wherein the laser energy is about 0.0075 joules per pulse and a laser spot diameter of about 0.003 inches.
19 . The apparatus of claim 14 wherein the range of laser energy per probe is between about 0.005 and 0.02 joules.Join the waitlist — get patent alerts
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