Film forming apparatus and film forming method

Abstract

A film forming apparatus is provided which includes a device A that generates liquid fine particles having controlled particle diameters; a device B including a via for guiding the generated liquid fine particles while controlling a temperature thereof; a device C that sprays the guided liquid fine particles; and a device D including a space for forming a transparent conductive film by coating the sprayed liquid fine particles onto a subject to be processed.

1 . A film forming method for forming a film on a base material by spray pyrolysis deposition comprising:
 generating liquid fine particles having controlled particle diameters;   guiding the liquid fine particles through a via while performing temperature control; and   spraying the liquid fine particles onto the base material, thus forming a film thereon.   
     
     
         2 . The film forming method of  claim 1 , wherein spraying the liquid fine particles comprises spraying the liquid fine particles from at least one nozzle, wherein at an intake portion of the nozzle a face velocity is V 1 , at a discharge portion of the nozzle, a face velocity is V 2 , and V 2 >1.5×V 1 . 
     
     
         3 . The film forming method of  claim 2 , wherein a cross-sectional area of the intake portion is E 1 , a cross-sectional area of the discharge portion is E 2 , and E 1 >1.5×E 2 . 
     
     
         4 . The film forming method of  claim 1 , wherein spraying the liquid fine particles comprises spraying the liquid fine particles from at least one nozzle while moving the at least one nozzle in a substantially horizontal reciprocating movement. 
     
     
         5 . The film forming method of  claim 4 , further comprising moving the at least one nozzle away from the base material during the reciprocating movement when the nozzle is changing direction.