Scalable subsystem architecture having integrated cooling channels

Abstract

A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.

1 . A method for building a scalable electronic system or subsystem comprising the steps of:
 a) fabricating a stackable module;   b) stacking a plurality of said modules to form said system or subsystem with a cooling channel provided between each pair of modules; and,   c) circulating a coolant in said cooling channel.   
   
   
       2 . The method of  claim 1  wherein said stackable module is fabricated on a copper substrate. 
   
   
       3 . The method of  claim 2  and including the step of testing each of said stackable modules prior to said stacking. 
   
   
       4 . The method of  claim 3  and further including the step of re-working any defective chips in each of said tested modules prior to said stacking.