US2009194163A1PendingUtilityA1
Method to form a photovoltaic cell comprising a thin lamina
Assignee: TWIN CREEKS TECHNOLOGIES INCPriority: Feb 5, 2008Filed: Sep 10, 2008Published: Aug 6, 2009
Est. expiryFeb 5, 2028(~1.5 yrs left)· nominal 20-yr term from priority
H10F 71/139H10F 71/121H10F 10/166H10F 10/146H10F 71/1395H10F 71/1276H10F 71/1257H10F 71/1218H10F 71/1212H10F 10/165H10F 10/11H10F 77/1662H10F 77/1642H10F 77/1645H10F 77/211Y02E10/544Y02E10/545Y02E10/546Y02P70/50Y02E10/547Y02E10/548
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Claims
Abstract
A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic cell, or all or a portion of the base or emitter of a photovoltaic cell, is formed within the lamina. In preferred embodiments, the wafer is affixed to a receiver before the cleaving step. Electrical contact can be formed to both surfaces of the lamina, or to one surface only.
Claims
exact text as granted — not AI-modified1 . A photovoltaic module comprising:
a receiver; and a plurality of semiconductor laminae bonded to the receiver, wherein each semiconductor lamina is between about 1 and about 100 microns thick, wherein each semiconductor lamina comprises at least a portion of a base, or of an emitter, of a photovoltaic cell.
2 . The photovoltaic module of claim 1 wherein each semiconductor lamina is between about 1 and about 20 microns thick.
3 . The photovoltaic module of claim 2 wherein each semiconductor lamina is between about 1 and about 5 microns thick
4 . The photovoltaic module of claim 1 wherein each semiconductor lamina is monocrystalline silicon.
5 . The photovoltaic module of claim 1 wherein each semiconductor lamina is polycrystalline or multicrystalline semiconductor material.
6 . The photovoltaic module of claim 1 wherein the plurality of semiconductor laminae comprises at least 12 laminae.
7 . The photovoltaic module of claim 1 wherein the plurality of semiconductor laminae comprises at least 36 laminae.
8 . The photovoltaic module of claim 1 wherein the receiver is a substrate.
9 . The photovoltaic module of claim 1 wherein the receiver is a superstrate.
10 . The photovoltaic module of claim 1 wherein each semiconductor lamina comprises a base of a photovoltaic cell.
11 . The photovoltaic module of claim 1 wherein each semiconductor lamina comprises a base and an emitter of a photovoltaic cell.
12 . The photovoltaic module of claim 11 wherein each semiconductor lamina consists essentially of monocrystalline silicon.
13 . The photovoltaic module of claim 11 wherein each semiconductor lamina is less than about 5 microns thick.
14 . The photovoltaic module of claim 1 wherein the receiver comprises glass.
15 . The photovoltaic module of claim 1 wherein the receiver comprises metal.
16 . The photovoltaic module of claim 1 wherein the receiver comprises a polymer.Join the waitlist — get patent alerts
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