Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device

Abstract

The present invention provides a solution to the above-described drawbacks, and more specifically, as the tape-like or sheet-like insulation member, the resin matrix in which the first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix, and the second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, are diffused, is employed.

1 . A tape-like or sheet-like highly heat conductive insulating member including a mica layer and a backing material layer, the insulating member being wherein the mica layer comprises: mica paper made of mica scales; and second particles having a diameter of 0.15 times or less of that of the mica scales and having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, that are diffused in the mica paper. 
   
   
       2 . The insulating member according to  claim 1 , wherein the second particles are made of one or more types selected from the group consisting of boron nitride, carbon, aluminum nitride, aluminum oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydroxide, artificial diamond, diamond-like carbon, carbon-like diamond, silicon carbide, gold, cupper, iron, laminar silicate clay mineral and mica. 
   
   
       3 . The insulating member according to  claim 1 , wherein the second particles are made of either one of carbon and aluminum oxide. 
   
   
       4 . The insulating member according to  claim 1 , wherein the mica layer is provided on both surfaces of the backing material layer. 
   
   
       5 . The insulating member according to  claim 1 , wherein the backing material layer comprises: a resin matrix; first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix; and second particles having a diameter of 0.15 times or less of that of the first particles and having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix. 
   
   
       6 . The insulating member according to  claim 1 , wherein the mica layer is formed wider than the backing material layer.