Polishing Composition and Polishing Method Using The Same

Abstract

The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.

1 . A polishing composition comprising a nitrogen-containing nonionic surfactant and abrasive grains, wherein the polishing composition has a pH of 9 to 12. 
   
   
       2 . The polishing composition according to  claim 1 , wherein the nitrogen-containing nonionic surfactant is contained in the polishing composition in an amount of 20 to 500 ppm. 
   
   
       3 . The polishing composition according to  claim 1 , wherein the abrasive grains are colloidal silica. 
   
   
       4 . The polishing composition according to  claim 1 , wherein the average primary particle diameter of the abrasive grains is 10 to 90 nm. 
   
   
       5 . The polishing composition according to  claim 1 , wherein the abrasive grains are contained in the polishing composition in an amount of 1.0 to 5.0% by mass. 
   
   
       6 . A polishing method comprising:
 preparing a polishing composition containing abrasive grains and a nitrogen-containing nonionic surfactant, wherein the polishing composition has a pH of 9 to 12; and   polishing polysilicon by using the polishing composition.