Liquid cooling device for multiple electronic components

Abstract

A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components.

1 . A liquid cooling device for multiple electronic components, the liquid cooling device comprising:
 two liquid blocks communicating with each other via tubing and being filled with coolant, each of the liquid blocks for being mounted on an electronic component;   a heat-dissipating plate integrally extending from and being outside one of the liquid blocks for being mounted on another electronic component;   a pump being connected and communicating with one of the liquid blocks via tubing; and   a heat sink being connected and communicating with the pump and one of the liquid blocks via tubing.   
   
   
       2 . The liquid cooling device as claimed in  claim 1 , wherein each liquid block comprises:
 a base having a bottom surface in contact with the electronic component; and   a cover being mounted on the base and formed with an inlet and an outlet.   
   
   
       3 . The liquid cooling device as claimed in  claim 2 , wherein each liquid block further comprises multiple heat-dissipating fins being formed on a top surface of the base inside the cover. 
   
   
       4 . The liquid cooling device as claimed in  claim 1 , wherein the heat-dissipating plate is formed with multiple heat-dissipating fins outside the cover. 
   
   
       5 . The liquid cooling device as claimed in  claim 2 , wherein the heat-dissipating plate is formed with multiple heat-dissipating fins outside the cover. 
   
   
       6 . The liquid cooling device as claimed in  claim 3 , wherein the heat-dissipating plate is formed with multiple heat-dissipating fins outside the cover. 
   
   
       7 . The liquid cooling device as claimed in  claim 5 , wherein the heat-dissipating plate integrally extends from the base of a corresponding one of the liquid blocks. 
   
   
       8 . The liquid cooling device as claimed in  claim 6 , wherein the heat-dissipating plate integrally extends from the base of a corresponding one of the liquid blocks.