Liquid cooling device
Abstract
A liquid cooling device includes a liquid block, a heat-dissipating plate, a thermal-conductive pipe, a pump and a heat sink. The liquid block, the pump, and the heat sink are connected by ducts. The pump drives a coolant to circulate among them. The thermal-conductive pipe is mounted on the heat-dissipating plate. Both ends of the thermal-conductive pipe are connected to the liquid block for the coolant to flow through. The liquid block and the heat sink are respectively mounted on the corresponding electronic devices to absorb heat using the circulating coolant. The heat sink is used to dissipate heat from another heat-generating electronic device. Therefore, one less liquid block is required, and the production cost becomes lower.
Claims
exact text as granted — not AI-modified1 . A liquid cooling device comprising:
a liquid block filled with a coolant for mounting on an electronic device to absorb heat; a heat-dissipating plate for mounting on another electronic device to absorb heat; a thermal-conductive pipe connected between the heat-dissipating plate and the liquid block and in fluid communications with the liquid block for the coolant to flow through; a pump communicating with the liquid block; and a heat sink communicating with the pump and the liquid block.
2 . The liquid cooling device as claimed in claim 1 , wherein the heat-dissipating plate includes:
a bottom plate having a bottom surface in contact with the electronic device and having a top surface formed with two parallel grooves; a fixing plate mounted on the top surface of the bottom plate and formed with concave portions corresponding to the grooves on the bottom plate so that an accommodating space is formed between the concave portions and the grooves for the thermal-conductive pipe.
3 . The liquid cooling device as claimed in claim 2 , wherein the thermal-conductive pipe has a U shape configuration with two parallel portions respectively mounted on the corresponding grooves of the heat-dissipating plate, thereby fixed by the concave portions of the fixing plate and the corresponding grooves.
4 . The liquid cooling device as claimed in claim 3 , wherein the fixing plate is mounted to the top surface of the bottom plate of the heat-dissipating plate by screws.
5 . The liquid cooling device as claimed in claim 1 wherein the top surface of the bottom plate of the heat-dissipating plate is further provided with a plurality of heat-dissipating fins on both sides of the bottom plate.
6 . The liquid cooling device as claimed claim 2 wherein the top surface of the bottom plate is further provided with a plurality of heat-dissipating fins on both sides of the bottom plate.
7 . The liquid cooling device as claimed in claim 3 wherein the top surface of the bottom plate is further provided with a plurality of heat-dissipating fins on both sides of the bottom plate.
8 . The liquid cooling device as claimed in claim 4 wherein the top surface of the bottom plate is further provided with a plurality of heat-dissipating fins on both sides of the bottom plate.
9 . The liquid cooling device as claimed in claim 1 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
10 . The liquid cooling device as claimed in claim 2 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
11 . The liquid cooling device as claimed in claim 3 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
12 . The liquid cooling device as claimed in claim 4 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
13 . The liquid cooling device as claimed in claim 5 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
14 . The liquid cooling device as claimed in claim 6 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
15 . The liquid cooling device as claimed in claim 7 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.
16 . The liquid cooling device as claimed in claim 8 , wherein the liquid block includes:
a body mounted on the electronic device and has two chambers, a plurality of heat-dissipating fins formed in the two chambers, and four fluid inlets/outlets formed on an outer surface of the body and in fluid communications with the corresponding chambers in pairs; and a separator mounted in the body between the two chambers.Join the waitlist — get patent alerts
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