Binderless metal injection molding apparatus and method

Abstract

A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first die half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.

1 . A metal injection molding apparatus, comprising:
 a metal inflection mold die having first and second die halves;   a first set of features provided in said first die half;   a second set of features provided in said second die half and complementary to said first set of features provided in said first die half; and   an ultrasonic transducer disposed in contact with said metal injection mold die.   
     
     
         2 . The metal injection molding apparatus of  claim 1  wherein said first set of features and said second set of features each comprises a plurality of die cavities. 
     
     
         3 . The metal injection molding apparatus of  claim 1  further comprising a metal powder injecting system disposed in communication with said first set of features and said second set of features. 
     
     
         4 . The metal injection molding apparatus of  claim 3  wherein said metal powder injecting system comprises an injection conduit disposed in communication with said first set of features and said second set of features. 
     
     
         5 . The metal injection molding apparatus of  claim 4  further comprising a fill hopper disposed in communication with said injection conduit. 
     
     
         6 . A metal injection molding apparatus, comprising:
 a metal injection mold die having a first die half and second die half; disposed in removable contact with said first die half;   a first set of features provided in said first die half;   a second set of features provided in said second die half and complementary to said first set of features provided in said first die half;   an ultrasonic transducer disposed in contact with said metal injection mold die; and   a metal powder injecting system disposed in communication with said first set of features provided in said first die half.   
     
     
         7 . The metal injection molding apparatus of  claim 6  wherein said first set of features and said second set of features each comprises a plurality of die cavities. 
     
     
         8 . The metal injection molding apparatus of  claim 6  wherein said metal powder injecting system comprises an injection conduit disposed in communication with said first set of features and said second set of features. 
     
     
         9 . The metal injection molding apparatus of  claim 8  further comprising a fill hopper disposed in communication with said injection conduit. 
     
     
         10 . A binderless metal injection molding method, comprising:
 providing a metal injection mold die having die features;   injecting metal powder into said die features of said metal injection mold die without plastic binder; and   compacting said metal powder in said die features of said metal injection mold die by inducing ultrasonic vibrations in said metal injection mold die.   
     
     
         11 . The method of  claim 10  wherein said compacting said metal powder in said die features of said metal injection mold die comprises providing an ultrasonic transducer, placing said ultrasonic transducer in contact with said metal injection mold die and operating said ultrasonic transducer. 
     
     
         12 . The method of  claim 10  wherein said providing a metal injection mold die having die features comprises providing a metal injection mold die having die cavities.