Apparatus and method for producing microcomponents and use of

Abstract

An apparatus and the use of such an apparatus and method for producing microcomponents with component structures are presented which are generated in a process chamber on a substrate according to the LIGA method for example and are stripped from the enclosing photoresist with the help of a cooled remote plasma source.

1 . A method for producing microcomponents with component structures which are produced on a substrate by using the LIGA method for example, with the microcomponents being stripped in an etching chamber from photoresist based on epoxy resin, characterized in that the photoresist is stripped in a controlled manner with a cooled remote plasma source by chemical etching through increased density of the radicals, with the temperatures of the microcomponents being monitored individually and the temperature curves being subjected to an individual recognition of the end point. 
   
   
       2 . A method according to  claim 1 , wherein the individual temperature measurement is made in real time via thermal sensors which are in mechanical contact via a thermostatized work plate distributed beneath the positions of the microcomponents either with the substrate itself or with a substrate holder on which the substrate is disposed. 
   
   
       3 . A method according to  claim 1 , wherein the substrate is pressed in a planar manner with the help of a contact means such as wax for example against the substrate holder which rests in a planar way on the thermostatized work plate ( 3 ) and is severed again after the end of the stripping process, through which the reaction heat is dissipated during the stripping process from the substrate to the substrate holder and from there via its bottom side to the thermostatized work plate, so that the substrate is not damaged as a result of the thermal and mechanical loading. 
   
   
       4 . A method according to  claim 1 , wherein the individually transmitted temperature curves are used as evaluation criteria for individually recognizing the end point, with the temperature rising with the start of the stripping process from an initial temperature as a result of reaction heat following the reaction of the photoresist with the radicals to an equilibrium temperature and remaining stable as long as the reaction occurs and decreasing with the end of the stripping process to an end temperature, through which the recognition of the end point is linked to the decreasing flank of the temperature curve. 
   
   
       5 . A method according to  claim 1 , wherein the density of the radicals in the plasma is increased with the help of an external microwave source for promoting a higher stripping rate of the photoresist. 
   
   
       6 . A method according to  claim 1 , wherein an external plasma chamber for providing the remote plasma for the benefit of lower thermal loading of the microcomponents disposed in an etching chamber is cooled with a coolant, through which the microcomponents already stripped of photoresist can easily remain in the etching chamber until the end of all stripping processes is recognized on the basis of the individually transmitted temperature curves and the etching process is thus terminated in due time. 
   
   
       7 . A method according to  claim 1 , wherein the individual end point recognition signalizes the end of each stripping process via a display of a monitoring device, so that the respectively finished stripped microcomponent can optionally be removed from the etching chamber. 
   
   
       8 . An apparatus for producing microcomponents with component structures according to the method according to  claim 1 , wherein a microwave source is arranged for increasing the density of the radicals outside of the etching chamber. 
   
   
       9 . An apparatus according to  claim 8 , wherein a plasma chamber which is cooled with a coolant is arranged outside of the etching chamber. 
   
   
       10 . An apparatus  claim 8 , wherein a substrate is connected in a planar way with a substrate holder via a contact means such as via wax for example and is detachable again after the stripping process. 
   
   
       11 . An apparatus according to  claim 8 , wherein at least one thermal sensor is arranged in the thermostatized work plate beneath the positions of the microcomponents either underneath a substrate or underneath a substrate holder on which the substrate is disposed. 
   
   
       12 . An apparatus according to  claim 1 , wherein a monitoring device displays the temperature curves transmitted individually by the thermal sensors and individually monitors and signalizes the end points of the stripping processes. 
   
   
       13 . The use of an apparatus according to  claim 8  for producing microcomponents with component structures by using the LIGA method for example, characterized in that a cooled remote plasma source with a high density of the radicals is used for stripping photoresist for microcomponents.