US2009212279A1PendingUtilityA1
Nanostructure-Based Electronic Device
Est. expiryFeb 27, 2028(~1.6 yrs left)· nominal 20-yr term from priority
H10W 20/0554H10W 20/0698B82Y 10/00H10K 85/221H10K 10/484H10K 10/481
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Claims
Abstract
The nanostructure-based electronic device comprises a solid support, an organic template layer, a nanostructure and electrodes. The organic template layer is on the surface of the solid support, and has a surface comprising a pair of spaced, electrically-charged regions arranged in tandem in an electrically-neutral background. The nanostructure is elongate, is electrically-conducting, and extends between the charged regions. The electrodes are located the surface of the template layer and are at least co-extensive with the charged regions.
Claims
exact text as granted — not AI-modified1 . An electronic device, comprising:
a solid support having a solid support surface; an organic template layer on the solid support surface, the template layer having a surface comprising a pair of spaced, electrically-charged regions arranged in tandem in an electrically-neutral background; an elongate, electrically-conducting nanostructure extending between the charged regions; and on the surface of the template layer, electrodes at least co-extensive with the charged regions.
2 . The electronic device of claim 1 , in which the nanostructure comprises a single carbon nanotube.
3 . The electronic device of claim 2 , in which the nanostructure additionally comprises one or more additional carbon nanotubes, the single nanotube and the additional nanotubes arranged side-by-side.
4 . The electronic device of claim 2 , in which the nanostructure additionally comprises one or more additional carbon nanotubes, the single nanotube and the additional nanotubes collectively constituting a nanorope.
5 . The electronic device of claim 1 , in which the nanostructure comprises one or more doped semiconductor nanowires.
6 . The electronic device of claim 1 , in which the nanostructure comprises one or more undoped semiconductor nanowires.
7 . The electronic device of claim 1 , in which the nanostructure comprises one or more metal nanowires.
8 . The electronic device of claim 1 , in which the nanostructure comprises one or more doped semiconductor nanoribbons.
9 . The electronic device of claim 1 , in which the nanostructure comprises one or more doped semiconductor nanofibers.
10 . The electronic device of claim 1 , in which:
the electronic device additionally comprises, in each of the charged regions and co-extensive therewith, a respective seed region comprising metal particles; and the electrodes each overlay a respective one of the seed regions.
11 . The electronic device of claim 10 , in which the seed regions are of a metal different from the electrodes.
12 . The electronic device of claim 1 , in which:
one of the charged regions is offset from the other of the charged regions in a first direction; and the charged regions are elongate in the first direction.
13 . A method of making an electronic device, the method comprising:
providing an elongate, electrically-conducting nanostructure immobilized by a pair of spaced, electrically-charged regions arranged in tandem on an electrically-neutral surface of a template layer supported by a solid support; contacting the template layer with a solution of a metal salt to deposit metal ions within the electrically-charged regions; reducing the metal ions within each of the charged regions to form a respective seed region comprising particles of the metal; and selectively depositing metal over the seed region to form electrodes that electrically contact the nanostructure at respective locations offset from one another along the length of the nanostructure.
14 . The method of claim 13 , in which the providing comprises:
providing a substrate, the substrate having a substrate surface; forming the template layer on the substrate surface; and selectively subjecting regions of the surface of the template layer at desired locations to an electric field that electrochemically causes the regions of the template layer to be locally charged.
15 . The method of claim 14 , in which the subjecting comprises:
providing an electrically-conducting scanning probe microscope probe comprising a probe tip; locating the probe tip adjacent the surface of the template layer in the desired location of one of the charged regions; and applying a voltage between the probe tip and the substrate.
16 . The method of claim 15 , in which:
the charged regions of the template layer are elongate in a first direction; and the subjecting additionally comprises moving one of the probe tip and the substrate relative to the other in the first direction.
17 . The method of claim 14 , in which the subjecting comprises:
providing an electrode tool comprising electrodes each having a shape corresponding to a desired shape of a respective one the charged regions; locating the electrodes of the electrode tool adjacent the surface of the template layer in a desired location of the charged regions; and applying a voltage between the electrodes of the electrode tool and the substrate.
18 . The method of claim 14 , in which the providing additionally comprises:
contacting the surface of the template layer with a suspension comprising elongate nanostructures; and removing from the surface of the template layer ones of the nanostructures not immobilized thereon by contact with the charged regions.
19 . The method of claim 14 , in which the providing additionally comprises:
contacting the surface of the template layer with a charge-reversing agent; and contacting the surface of the template layer with a suspension comprising elongate nanostructures, the nanostructures having the same electrical charge polarity as the charged regions.
20 . The method of claim 13 , in which the reducing comprises contacting the template layer with a reducing agent to form the metal particles of the seed regions from the ions of the metal.
21 . The method of claim 13 , in which the depositing comprises an electroplating process.
22 . The method of claim 13 , in which the depositing comprises an electroless plating process.Join the waitlist — get patent alerts
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