Solder bump, electronic component and method for manufacturing the electronic component

Abstract

An electronic component includes a plurality of first electrode pads arranged on a first substrate, a plurality of second electrode pads arranged at positions corresponding to the first electrode pads on a second substrate and a plurality of solder bumps which join together the first electrode pads and the second electrode pads. Here, the first substrate is located over the second substrate so that the first electrode pads and the second electrode pads are at positions which are shifted from opposite positions where the first electrode pads opposite to the second electrode pads, and at least a part of the solder bumps are solidified into hourglass-shaped.

1 . A plurality of solder bumps which join together first electrode pads and second electrode pads at positions, which are shifted from opposite positions where said first electrode pads opposite to said second electrode pads, wherein
 at least a part of said solder bumps are solidified into hourglass-shaped.   
   
   
       2 . An electronic component, comprising:
 a plurality of first electrode pads arranged on a first substrate;   a plurality of second electrode pads arranged at positions corresponding to said first electrode pads on a second substrate; and   a plurality of solder bumps which join together said first electrode pads and said second electrode pads, wherein   said first substrate is located over said second substrate so that said first electrode pads and said second electrode pads are at positions which are shifted from opposite positions where said first electrode pads opposite to said second electrode pads, and at least a part of said solder bumps are solidified into hourglass-shaped.   
   
   
       3 . The electronic component according to  claim 2 , wherein
 the maximum length of said shifting between said first electrode pad and said second electrode pad which are corresponding is shorter than a diameter each of said first electrode pad and said second electrode pad.   
   
   
       4 . The electronic component according to  claim 2 , wherein
 said first electrode pads and said second electrode pads are at positions which are rotated parallel to said second substrate centering on a center of said first or second substrate from said opposite positions.   
   
   
       5 . The electronic component according to  claim 2 , wherein
 said first electrode pads and said second electrode pads are at positions which are slid in one direction parallel to said second substrate from said opposite positions.   
   
   
       6 . The electronic component according to  claim 2 , wherein
 said first substrate is a semiconductor chip and said second substrate is a resin substrate.   
   
   
       7 . A method for manufacturing an electronic component, comprising:
 arranging a plurality of first electrode pads and a plurality of second electrode pads on a first substrate and a second substrate respectively so that positions of said second electrode pads correspond to those of said first electrode pads;   forming a plurality of solder bumps on said second electrode pads respectively;   putting said first substrate over said second substrate so that said first electrode pads are respectively opposed to said second electrode pads via said solder bumps;   shifting said first substrate or said second substrate in parallel to said second substrate while said solder bumps are melting so that said solder bumps are stretched in a slant direction to cause said solder bumps to be solidified into hourglass-shaped.   
   
   
       8 . The method for manufacturing the electronic component according to  claim 7 , wherein
 the maximum length of said shifting between said first electrode pad and said second electrode pad which are corresponding is shorter than a diameter each of said first electrode pad and said second electrode pad.   
   
   
       9 . The method for manufacturing the electronic component according to  claim 7 , wherein
 said first substrate or said second substrate is shifted so that said first substrate rotates predetermined angle centering on center of said first or second substrate from their opposite positions.   
   
   
       10 . The method for manufacturing the electronic component according to  claim 7 , wherein
 said first substrate or said second substrate is shifted by sliding in one direction.   
   
   
       11 . A method for manufacturing an electronic component, comprising:
 arranging a plurality of first electrode pads and a plurality of second electrode pads on a first substrate and a second substrate respectively so that positions of said second electrode pads correspond to those of said first electrode pads;   forming a plurality of solder bumps on said second electrode pads respectively;   putting said first substrate over said second substrate via said solder bumps so that each of said first electrode pads and each of said second electrode pads are at positions which are shifted from their opposite positions to cause said solder bumps to be solidified into hourglass-shaped by heating.   
   
   
       12 . The method for manufacturing the electronic component according to  claim 11 , wherein
 the maximum length of said shifting between said first electrode pad and said second electrode pad which are corresponding is shorter than a diameter each of said first electrode pad and said second electrode pad.