Device for preheating a component cooled by conduction and/or by convection

Abstract

The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The component is in contact with a heat conductor and the device includes a heater to heat the part, the device further including at least one heat pipe having fluid within, to connect a heat dissipater with the heat conductor, the dissipater and the part furthermore being thermally insulated from one another. Freezing of fluid in the heat pipe facilitates preheating of the component at low temperature. The invention applies notably to the starting of components subjected to low temperatures, for example, components installed in systems on board aircraft.

1 . A device for preheating a component, the device comprising:
 a heat conductor in thermal contact with the component;   a heater to heat the heat conductor;   at least one heat pipe in thermal contact with the heat conductor, the at least one heat pipe having a solid phase that is thermally nonconductive, and a fluid phase that is thermally conductive; and   a heat dissipater in thermal contact with the at least one heat pipe, the heat dissipater being thermally insulated from the heat conductor when at least one heat pipe is in the solid phase.   
   
   
       2 . The device according to  claim 1 , wherein the heat-conducting part comprises an excrescence of the heat pipe. 
   
   
       3 . The device according to  claim 1 , wherein the heater comprises at least one heating resistor placed adjacent to the heat conductor. 
   
   
       4 . The device according to  claim 1 , wherein the heat pipe further comprises:
 a first end portion;   a central portion adjacent to the first end portion; and   a second end portion adjacent to the central portion, the second end portion opposite from the first end portion,   wherein the first end portion and the second end portion are in physical contact with the heat dissipater, and the central portion is in physical contact with the heat conductor.   
   
   
       5 . The device according to  claim 1 , wherein the heat conductor and the heat pipe are insulated in order to reduce the heat not conducted to the heat dissipater. 
   
   
       6 . The device according to  claim 1 , wherein a surface of the heat conductor is rounded in order to reduce the heat loss by radiation. 
   
   
       7 . The device according to  claim 1 , wherein the heat conductor and the heat pipe comprise low specific heat materials. 
   
   
       8 . The device according to  claim 1 , wherein the heat pipe further comprises a heat-conducting fluid having a solidification temperature at least equal to or slightly below a predetermined preheating temperature.