Chip Scale Package Tray

Abstract

Disclosed is a chip scale package tray. The chip scale package tray includes: a rectangular frame 10 ; a plurality of seat members 20 formed from a material relatively soft and superior in frictional force as compared to the frame 10 , the seat members 20 being arranged on the top of the frame 10 in a grid pattern, a semiconductor chip being loaded on the top of each of the seat members 20 ; and a plurality of support members 30 formed from a material relatively soft and superior in frictional force as compared to the frame 10 , the support members 30 being attached to the bottom of the frame 10 to be opposed to the seat members 20.

1 . A chip scale package tray comprising:
 a rectangular frame;   a plurality of seat members formed from a material softer and more superior in frictional force than the frame, the seat members being arranged on the top of the frame in a grid pattern, a semiconductor chip being loaded on the top of each of the seat members; and   a plurality of support members formed from a material softer and more superior in frictional force than the frame, the support members being attached to the bottom of the frame to be opposed to the seat members.   
   
   
       2 . The chip scale package tray as claimed in  claim 1 , wherein each of the seat members is formed from a material selected from the group consisting of elastic rubber and silicone;
 each of the seat members has a configuration including a seat area and a plurality of chip support pieces arranged around the periphery of the seat area;   each of the support members is formed from a material selected from the group consisting of elastic rubber and silicone; and   each of the support members has a configuration including a semiconductor chip contact area, and a plurality of engagement projections arranged around the periphery of the semiconductor chip contact area.   
   
   
       3 . The chip scale package tray as claimed in  claim 1 , wherein the frame is formed by introducing a synthetic resin into cavities formed in a first set of molds and by curing the synthetic resin in the cavities;
 the seat members are formed by interposing the frame between the cavities of a second set of molds, by introducing a first material, which is softer and more superior in frictional force than the frame, between the top of the frame and the cavities of one of the second set of molds in a molten state, and by curing the first material in the cavities; and   the support member is formed by introducing a second material, which is softer and more superior in frictional force than the frame, between the bottom of the frame and the cavities of the other of the second set of molds in a molten state, and by curing the second material in the cavities, whereby the frame, the seat members and the support members form a triple injection-molded structure.   
   
   
       4 . The chip scale package tray as claimed in  claim 3 , wherein a first set of fastening projections are integrally formed with the respective seat members on the bottom sides of the seat members to be opposed to the seat areas or the chip support pieces;
 a first set of fastening holes are formed through the frame, so that the first set of the fastening projections can be fitted in the first set of the fastening holes on the top of the frame;   a second set of fastening projections are integrally formed with the respective support members on the top sides of the support members to be opposed to the semiconductor chip contact areas or engagement projections; and   a second set of fastening holes are formed through the frame, so that the second set of the fastening projections can be fitted in the fastening holes on the bottom of the frame.   
   
   
       5 . The chip scale package tray as claimed in  claim 4 , wherein each of the first set of the fastening projections of the seat members is formed in a cross-sectional shape with the diameter increasing when moving from the bottom end to the top end thereof, while each of the second set of the fastening holes in the frame is formed in a specific shape with the diameter decreasing when moving from the bottom end to the top end thereof; and
 wherein each of the second set of the fastening projections of the support members is formed in a shape of a circular cross-section with the diameter increasing when moving from the top end to the bottom end thereof, while each of the second set of the fastening holes in the frame is formed in a specific shape with the diameter decreasing when moving from the top end to the bottom end thereof.   
   
   
       6 . The chip scale package tray as claimed in any one of  claims 1 - 5 , wherein the seat members and the support members are additionally provided with conductive particles.