Component cooling system

Abstract

A component cooling system includes a component tank configured to receive a heat-generating device. The component tank is at least partially filled with a subcooled liquid at a first pressure and at a first temperature. A cryogenic system maintains the component tank at essentially the first temperature. The cryogenic system includes a heat exchange system thermally coupled with at least a portion of the component tank. The heat exchange system is at least partially filled with a second saturated liquid at a second pressure and at essentially the first temperature. A cryostat tank is fluidly-coupled with the heat exchange system and allows for pumpless displacement of the second saturated liquid between the heat exchange system and the cryostat tank.

1 . A component cooling system comprising:
 a component tank configured to receive a heat-generating device, the component tank configured to be at least partially filled with a subcooled liquid at a first pressure and at a first temperature; and   a cryogenic system for maintaining the component tank at essentially the first temperature, the cryogenic system including:
 a heat exchange system thermally coupled with at least a portion of the component tank, the heat exchange system being at least partially filled with a second saturated liquid at a second pressure and at essentially the first temperature, and 
 a cryostat tank, the cryostat tank being fluidly-coupled with the heat exchange system for allowing for pumpless displacement of the second saturated liquid between the heat exchange system and the cryostat tank. 
   
   
   
       2 . The component cooling system of  claim 1  further comprising:
 a buffer tank configured to be at least partially filled with a first saturated liquid at a second temperature, the buffer tank being fluidly-coupled with the component tank for allowing for pumpless liquid displacement between the component tank and the buffer tank   
   
   
       3 . The component cooling system of  claim 2  further comprising:
 a heating system configured to heat the first saturated liquid within the buffer tank to maintain the first pressure within the component tank.   
   
   
       4 . The component cooling system of  claim 2  wherein the first saturated liquid and the second saturated liquid are saturated liquid nitrogen. 
   
   
       5 . The component cooling system of  claim 1  wherein the heat exchange system includes a heat exchanger device positioned within the component tank. 
   
   
       6 . The component cooling system of  claim 5  wherein the heat exchanger device includes one or more tubing assemblies through which the second saturated liquid passes. 
   
   
       7 . The component cooling system of  claim 6  wherein the heat exchanger device includes a thermally conductive mass through which the one or more tubing assemblies pass. 
   
   
       8 . The component cooling system of  claim 1  wherein the heat exchange system includes a heat exchanger device positioned external to the component tank. 
   
   
       9 . The component cooling system of  claim 8  wherein the heat exchanger device is a cooling tank encapsulating at least a portion of the component tank. 
   
   
       10 . The component cooling system of  claim 1  wherein the cryogenic system includes:
 a cryostat positioned within the cryostat tank and configured to maintain the second saturated liquid at essentially the first temperature.   
   
   
       11 . The component cooling system of  claim 1  wherein the heat-generating device is a fault current limiter device. 
   
   
       12 . The component cooling system of  claim 1  wherein the subcooled liquid is subcooled liquid nitrogen. 
   
   
       13 . The component cooling system of  claim 1  wherein the second temperature is greater than the first temperature. 
   
   
       14 . The component cooling system of  claim 1  wherein the second pressure is less than the first pressure. 
   
   
       15 . A component cooling system comprising:
 a component tank configured to receive a fault current limiter device, the component tank configured to be at least partially filled with a subcooled liquid at a first pressure and at a first temperature;   a buffer tank configured to be at least partially filled with a first saturated liquid at a second temperature, the buffer tank being fluidly-coupled with the component tank for allowing for pumpless liquid displacement between the component tank and the buffer tank;   a cryogenic system for maintaining the component tank at essentially the first temperature, the cryogenic system including:
 a heat exchange system thermally coupled with at least a portion of the component tank, the heat exchange system being at least partially filled with a second saturated liquid at a second pressure and at essentially the first temperature, and 
 a cryostat tank, the cryostat tank being fluidly-coupled with the heat exchange system for allowing for pumpless displacement of the second saturated liquid between the heat exchange system and the cryostat tank; and 
   a heating system configured to heat the first saturated liquid within the buffer tank to maintain the first pressure within the component tank.   
   
   
       16 . The component cooling system of  claim 15  wherein the heat exchange system is a heat exchanger device positioned within the component tank. 
   
   
       17 . The component cooling system of  claim 15  wherein the heat exchange system is a heat exchanger device encapsulating at least a portion of the component tank. 
   
   
       18 . The component cooling system of  claim 15  wherein the cryogenic system includes:
 a cryostat positioned within the cryostat tank and configured to maintain the second saturated liquid at essentially the first temperature.   
   
   
       19 . The component cooling system of  claim 15  wherein the subcooled liquid, the first saturated liquid, and the second saturated liquid are liquid nitrogen. 
   
   
       20 . A component cooling system comprising:
 a component tank configured to receive a heat-generating device, the component tank configured to be at least partially filled with a subcooled liquid at a first pressure and at a first temperature;   a buffer tank configured to be at least partially filled with a first saturated liquid at a second temperature, the buffer tank being fluidly-coupled with the component tank for allowing for pumpless liquid displacement between the component tank and the buffer tank; and   a cryogenic system for maintaining the component tank at essentially the first temperature, the cryogenic system including:
 a heat exchange system thermally coupled with at least a portion of the component tank, the heat exchange system being at least partially filled with a second saturated liquid at a second pressure and at essentially the first temperature, and 
 a cryostat tank, the cryostat tank being fluidly-coupled with the heat exchange system for allowing for pumpless displacement of the second saturated liquid between the heat exchange system and the cryostat tank; and 
 a cryostat positioned within the cryostat tank and configured to maintain the second saturated liquid at essentially the first temperature.