Three-dimensional stacked optical device

Abstract

A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.

1 . A three-dimensional stacked optical device comprising:
 a transparent substrate;   at least one interconnect member mounted to the transparent substrate, the at least one interconnect member extending across only a portion of the transparent substrate;   at least one optical device mounted to the at least one interconnect member on the transparent substrate, the at least one optical device having a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion;   an insulating layer encapsulating the at least one optical device, the insulating layer including a first surface that extends to a second surface, the first surface abutting the transparent substrate;   a communication path extending between the first surface of the at least one optical device and the second surface of the insulating layer; and   an electronic chip mounted to the second surface of the insulating layer, the electronic chip having a first surface and a second surface, the first surface being coupled to the communication path so as to form the three-dimensional stacked optical device.   
   
   
       2 . The three-dimensional stacked optical device of  claim 1 , further comprising: an isolating layer encapsulating the electronic chip, the isolating layer having a first surface that extends to a second surface, the first surface abutting the second surface of the insulating layer and extends to a second surface. 
   
   
       3 . The three-dimensional stacked optical device of  claim 2 , further comprising: another communication path extending between the first surface of the electronic chip and the second surface of the isolating layer. 
   
   
       4 . The three-dimensional stacked optical device of  claim 3 , further comprising: a plurality of connector members mounted to the second surface of the isolating layer, the plurality of connector members being coupled to at least the another communication path.