Three-dimensional stacked optical device

Abstract

A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.

1 . A three-dimensional stacked optical device comprising:
 a transparent substrate;   at least one optical device having a main body mounted to the transparent substrate, the at least one optical device including a plurality of vias that extend into the main body, the plurality of vias do not extend into the transparent substrate;   a conductive member provided in each of the plurality of vias of the at least one optical device, the conductive member forming backside contacts on the at least one optical device;   an electronic chip including a plurality of vias mounted to the backside contacts on the optical device; and   another conductive member deposited in each of the plurality of vias formed in the electronic chip, the another conductive member forming additional backside contacts on the electronic chip.   
   
   
       2 . The three-dimensional stacked optical device of  claim 1 , wherein the at least one optical device is embedded in an insulating layer. 
   
   
       3 . The three-dimensional stacked optical device of  claim 1 , wherein the electronic chip is embedded in an isolating layer having an outer surface, the backside contacts deposited at each of the plurality of vias formed in the electronic chip rest upon the outer surface of the isolating layer.