Device for Producing a Metal Strip by Continuous Casting

Abstract

The invention relates to a device for producing a metal strip ( 1 ) by continuous casting, using a casting machine ( 2 ) in which a slab ( 3 ) is cast. At least one milling machine ( 4 ) is arranged in the direction of transport (F) of the slab ( 3 ) behind the casting machine ( 2 ). At least one surface of the slab ( 3 ), preferably two surfaces which are opposite to each other, can be milled in said milling machine. According to the invention, in order to obtain high quality surface machining by milling, in particular in relatively rigid slabs, a shaving conveying device ( 6 ) is arranged in the region of at least one milling cutter ( 5 ) of the milling machine ( 4 ) enabling the milled shavings ( 7 ) to be removed from the region of the milling cutter ( 5 ) in the direction (Q) perpendicular to the direction of transport (F) of the slab ( 3 ).

1 . A device for producing a metal strip ( 1 ) by continuous casting, with a casting machine ( 2 ), in which a slab ( 3 ) is cast, where at least one milling machine ( 4 ), in which a least one surface of the slab ( 3 ) can be milled off, is set up downstream of the casting machine ( 2 ) with respect to the transport direction (F),
 wherein, in the area of at least one milling cutter ( 5 ) of the milling machine ( 4 ), a chip conveying device ( 6 ) is set up, which conveys the milled-off chips ( 7 ) upward and/or in the direction (Q) transverse to the transport direction (F) of the slab ( 3 ) out of the area of the milling cutter ( 5 ),
 where the chip conveying device ( 6 ) comprises at least one screw conveyor, which is set up in the area of the surface ( 8 ) of the slab ( 3 ) and the longitudinal axis of which is transverse to the transport direction (F), or 
 where the chip conveying device ( 6 ) comprises at least one guide element ( 15 ), the slab ( 3 )-facing end ( 18 ) of which, when viewed in the direction (N) normal to the slab ( 3 ), forms an acute angle (a) to the direction (Q) transverse to the transport direction (F), or 
 where the chip conveying device ( 6 ) comprises at least one conveyor belt ( 9 ), which extends transversely to the transport direction (F) in the area of the surface ( 8 ) of the slab ( 3 ). 
   
     
     
         2 . A device according to  claim 1 , wherein a trough with a gradient is provided at one of the of the guide element ( 15 ). 
     
     
         3 . A device according to  claim 1 , wherein the conveyor belt ( 9 ) extends horizontally in the area of the surface ( 8 ) of the slab ( 3 ). 
     
     
         4 . A device according to  claim 1 , wherein the conveyor belt ( 9 ) is designed as an endless belt and, when seen in the transport direction (F), passes completely around the slab ( 3 ). 
     
     
         5 . A device according to  claim 4 , wherein the conveyor belt ( 9 ) is deflected over a number of guide pulleys ( 10 ), at least one of which is driven. 
     
     
         6 . A device according to  claim 1 , wherein the conveyor belt ( 9 ) is provided with cooling means ( 11 ) or is connected to means by which it can be cooled. 
     
     
         7 . A device according to  claim 6 , wherein the cooling means ( 11 ) are designed as spray nozzles, which can spray a cooling medium onto the conveyor belt ( 9 ). 
     
     
         8 . A device according to  claim 1 , wherein, with respect to the transport direction (F), a baffle plate ( 12 ) is set up upstream or downstream of the chip conveying device ( 6 ). 
     
     
         9 . A device according to  claim 8 , wherein the baffle plate ( 12 ) is provided with a number of guide vanes ( 13 ), which face the milling cutter ( 5 ). 
     
     
         10 . A device according to  claim 1 , wherein the chip conveying device ( 6 ) is set up on positioning means ( 14 ), by which it can be raised or lowered in the vertical direction and/or pivoted. 
     
     
         11 . A device according to  claim 1 , wherein a guide element ( 15 ′), by means of which chips ( 7 ) can be conducted from the surface ( 8 ) of the slab ( 3 ) onto the chip conveying device ( 6 ), is set up. 
     
     
         12 . A device according to  claim 11 , wherein the guide element ( 15 ′) comprises an edge ( 16 ) of heat-resistant material, which can be laid against the surface ( 8 ) of the slab ( 3 ). 
     
     
         13 . A device according to  claim 11 , wherein the guide element ( 15 ′) is pivotably supported around a horizontal axis ( 17 ) transverse to the transport direction (F) of the slab ( 3 ). 
     
     
         14 . A device according to  claim 11 , wherein the guide element ( 15 ′) is provided with cooling means ( 19 ) or is connected to means by which it can be cooled. 
     
     
         15 . A device according to  claim 14 , wherein the cooling means ( 19 ) are designed as spray nozzles, which can spray a cooling medium onto the guide element ( 15 ′). 
     
     
         16 . A device according to  claim 1 , wherein high-pressure water or compressed air nozzles ( 27 ,  49 ) are also provided, which support the transport of the chips. 
     
     
         17 . A device according to  claim 16 , wherein the high-pressure water or compressed air nozzles ( 27 ,  49 ) convey chips onto the conveyor belt ( 9 ) or to a guide element ( 15 ,  15 ′) or to a screw-shaped receiving element ( 54 ). 
     
     
         18 . A device according to  claim 1 , wherein lateral roller guides ( 30 ) are provided to absorb the axial forces acting on the milling cutter ( 5 ). 
     
     
         19 . A device according to  claim 1 , wherein milling cutter ( 5 ) used at least for the top surface of the slab is a face cutter ( 36 ). 
     
     
         20 . A device according to  claim 19 , wherein several face cutters ( 36 ) are provided, which, when viewed in the transport direction (F), are arranged to overlap. 
     
     
         21 . A device according to  claim 19 , wherein the face cutter ( 36 ) comprises a number of cutting edges ( 37 ), which can be cooled by a cutting edge cooling system ( 39 ). 
     
     
         22 . A device according to  claim 1 , wherein a transfer table ( 40 ) is provided, which is designed so that the slab ( 3 ) can rest on it in the area of the milling cutter or cutters ( 5 ). 
     
     
         23 . A device according to  claim 22 , wherein the transfer table ( 40 ) is designed with internal cooling. 
     
     
         24 . A device according to  claim 1 , wherein the chip conveying device ( 6 ) is designed as a screw-shaped receiving element ( 54 ). 
     
     
         25 . A device according to  claim 24 , wherein a guide element ( 15 ) is provided, which is designed to convey chips from the top surface of the slab into the receiving element ( 54 ) designed with a screw-like shape. 
     
     
         26 . A device according to  claim 24 , wherein a deflecting plate ( 52 ) is provided, where the deflecting plate ( 52 ) can be sprayed with a jet of transport water discharged from a nozzle bar ( 49 ). 
     
     
         27 . A device according to  claim 1 , wherein a guide channel is provided, through which the chips are drawn by suction from the top surface of the slab directly behind the milling gap, where the chips are transported away through a pipe transverse to the transport direction (F). 
     
     
         28 . A device according to  claim 1 , wherein at least one magnet is set up, by means of which the chips can be influenced as they are being carried away.