Fluid ejection device utilizing a one-part epoxy adhesive

Abstract

A fluid ejection device, including a substrate carrier having a substrate receiving-surface, and a substrate having at least one fluid ejector actuator disposed on the substrate. In addition the fluid ejection device includes a one-part adhesive disposed between the substrate and the substrate-receiving-surface. The one-part adhesive is an epoxy resin having a polyglycidyl ether of a polyhydric phenol, a solid cylcoaliphatic amine curing agent.

1 . A method of manufacturing a fluid ejection device, comprising:
 dispensing a one-part epoxy adhesive on a substrate or on a substrate receiving-surface of a substrate carrier, said substrate having at least one fluid ejector actuator disposed thereon, and said one-part epoxy adhesive comprises:
 an epoxy resin having a polyglycidyl ether of a polyhydric phenol, and 
 a solid cylcoaliphatic amine curing agent; 
   forming an adhesive bond structure between said substrate and substrate carrier; and   curing said one-part epoxy adhesive.   
     
     
         2 . The method of manufacturing in accordance with  claim 1 , wherein dispensing said one-part epoxy adhesive further comprises dispensing said one-part epoxy adhesive having a liquid aromatic amine curing agent. 
     
     
         3 . The method of manufacturing in accordance with  claim 1 , further comprising dispensing said one-part epoxy adhesive to encapsulate a substrate bond pad disposed on said substrate and an electrical interconnection electrically coupled to said substrate bond pad. 
     
     
         4 . The method of manufacturing in accordance with  claim 1 , further comprising dispensing said one-part epoxy adhesive forming a moat-fill adhesive structure in a volume formed between said substrate carrier, a substrate edge surface of said substrate, and a cover edge surface of a cover disposed on the fluid ejection device. 
     
     
         5 . The method of manufacturing in accordance with  claim 1 , further comprising dispensing said one-part epoxy adhesive forming a glob top structure substantially encapsulating an electronic device disposed on or within the fluid ejection device. 
     
     
         6 . The method of manufacturing in accordance with  claim 1 , further comprising dispensing said one-part epoxy adhesive forming an underfill adhesive structure between said substrate carrier and an electrical connector having:
 a body, and   a connector electrical conductor.   
     
     
         7 . The method of manufacturing in accordance with  claim 6 , further comprising dispensing said one-part epoxy adhesive forming an electrical connector attach adhesive structure between a fluid ejection body portion and said electrical connector. 
     
     
         8 . The method of manufacturing in accordance with  claim 6 , further comprising dispensing said one-part adhesive forming an adhesive bond between said body and said substrate carrier.