Semiconductor device manufacturing apparatus and semiconductor device manufacturing method

Abstract

A semiconductor device manufacturing apparatus which uses a thermal CVD reaction to deposit a film onto a substrate has a ring with an electrode terminal that makes contact with either the substrate or the deposited film thereon, a power supply that applies a current or a potential to this electrode terminal of the ring, and a piston cylinder mechanism for moving the ring up and down, so as to cause its electrode terminal to make and break contact with the substrate or deposited film thereon.

1 - 28 . (canceled) 
   
   
       29 . A semiconductor device manufacturing method for depositing a film on a substrate by a thermal CVD reaction, wherein a d.c. electrical potential is applied across said substrate or film deposited thereupon without making contact with said substrate or film deposited thereupon. 
   
   
       30 . A semiconductor device manufacturing method according to  claim 29 , wherein magnetic flux is applied to said substrate or film deposited thereupon. 
   
   
       31 - 32 . (canceled)