Thermoelectric device based refrigerant subcooling

Abstract

A subcooler ( 15 ) for a vapor compression cycle having a refrigerant. The subcooler ( 15 ) including a conduit ( 45 ) and one or more thermoelectric modules ( 17 ). The conduit ( 45 ) being in fluid communication with the vapor compression cycle for flow of the refrigerant therethrough. Each of the one or more thermoelectric modules ( 17 ) has a cold side in thermal communication with an inner volume of the conduit ( 45 ) for subcooling the refrigerant.

1 . A subcooler for a vapor compression cycle having a refrigerant, the subcooler comprising:
 a conduit in fluid communication with the vapor compression cycle for flow of the refrigerant therethrough; and   one or more thermoelectric modules, wherein each of said one or more thermoelectric modules has a cold side in thermal communication with an inner volume of said conduit for subcooling the refrigerant.   
   
   
       2 . The subcooler of  claim 1 , wherein each of said one or more thermoelectric modules has a warm side in thermal isolation from said inner volume of said conduit. 
   
   
       3 . The subcooler of  claim 1 , wherein said one or more thermoelectric modules are embedded in said conduit, and wherein said cold side directly contacts the refrigerant. 
   
   
       4 . The subcooler of  claim 1 , wherein said one or more thermoelectric modules further comprises a secondary heat exchanger for indirect heat exchange with the refrigerant. 
   
   
       5 . The subcooler of  claim 1 , wherein said one or more thermoelectric modules comprise a thermoelectric heat exchanger. 
   
   
       6 . The subcooler of  claim 5 , wherein said thermoeletric heat exchanger is an air or liquid thermoelectric heat exchanger. 
   
   
       7 . The subcooler of  claim 1 , wherein at least one of said one or more thermoelectric modules are connected to an outer surface of said conduit and in thermal communication with said refrigerant. 
   
   
       8 . The subcooler of  claim 7 , further comprising a fan that provides air flow in thermal communication with a warm side of said one or more thermoelectric modules. 
   
   
       9 . A vapor compression system comprising:
 a compressor, a condensor, and an evaporator connected to each other via a conduit; and   a subcooler having one or more thermoelectric modules connected to said conduit, wherein each of said one or more thermoelectric modules has a cold side in thermal communication with an inner volume of said conduit for subcooling refrigerant circulating therethrough.   
   
   
       10 . The vapor compression system of  claim 9 , wherein each of said one or more thermoelectric modules has a warm side in thermal isolation from said inner volume of said conduit. 
   
   
       11 . The vapor compression system of  claim 9 , wherein said one or more thermoelectric modules are embedded in said conduit to contact cool said refrigerant. 
   
   
       12 . The vapor compression system of  claim 9 , wherein said one or more thermoelectric modules comprise a thermoelectric heat exchanger. 
   
   
       13 . The vapor compression system of  claim 12 , wherein said thermoelectric heat exchanger is an air or liquid thermoelectric heat exchanger. 
   
   
       14 . The vapor compression system of  claim 9 , wherein said one or more thermoelectric modules are connected to an outer surface of said conduit and in thermal communication with said refrigerant. 
   
   
       15 . The vapor compression system of  claim 14 , wherein said subcooler further comprises a fan that provides air flow in thermal communication with a warm side of said one or more thermoelectric modules. 
   
   
       16 . A method of subcooling a vapor compression cycle comprising:
 providing a conduit for flow of a refrigerant that is in fluid communication with a compressor, a condensor, and an evaporator; and   thermoelectrically subcooling an inner volume of said conduit through conduction by a plurality of thermoelectric modules each having a cold side in thermal communication with said inner volume of said conduit and a warm side in thermal isolation from said inner volume.   
   
   
       17 . The method of  claim 16 , wherein a plurality of thermoelectric modules is cooled via a fan. 
   
   
       18 . The method of  claim 16 , wherein said plurality of thermoelectric modules are embedded in said conduit to contact cool said refrigerant. 
   
   
       19 - 20 . (canceled)