US2009271979A1PendingUtilityA1
Circuitry for printer
Est. expiryDec 14, 2025(expired)· nominal 20-yr term from priority
Inventors:Dan Leo MassopustCurtis Douglass KellerSteven R. SlottoPeter J. NystromJohn R. AndrewsSteven Van Cleve KorolScott Taylor TreeceBritton T. PinsonChad J. SlenesSamuel SchultzLee M. OienJonathan Robert Brick
B41J 2002/14491B41J 2202/18Y10T29/49126H05K 3/321H05K 3/3485H05K 2203/063H05K 3/363H05K 2203/0191B41J 2/0057H05K 2201/10977B41J 2/1408H05K 3/305H05K 3/361
50
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Claims
Abstract
A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.
Claims
exact text as granted — not AI-modified1 . A method of providing a high-density interconnection between two members, comprising:
applying a layer of adhesive having an array of holes to a first member having a first set of contact pads such that the holes align with the contact pads; depositing an adhesive conductive material into the holes; aligning a second member having a second set of contact pads such that the second set of contact pads are aligned with the holes to form an assembly; and using a hot bar on the assembly to mechanically bond the first member to the second member.
2 . The method of claim 1 , applying a layer of adhesive further comprising applying a sheet adhesive.
3 . The method of claim 1 , depositing an adhesive, conductive material further comprising depositing one of a material from the group consisting of: conductive paste, silver epoxy, low melt solder paste, and indium alloy powders suspended in a flux.
4 . The method of claim 1 , applying a layer of adhesive to a first member further comprising applying a layer of adhesive to a printed circuit board.
5 . The method of claim 1 , aligning a second member further comprising aligning a printed circuit board.
6 . The method of claim 1 , the method further comprising reusing the hot bar to the assembly and separating the first and second members.Cited by (0)
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