Functional Unit And Method For The Production Thereof

Abstract

The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer and, on the outer side of the functional unit, contacts are provided for contacting the electrical components for further mounting.

1 . An apparatus, comprising:
 a functional unit, containing at least one active or passive electronic component;   at least one flexible dielectric layer surrounding said functional unit; and   a plurality of contacts, provided on an outer side of the functional unit, for contacting the at least one electrical components for further mounting.   
     
     
         2 . The apparatus according to  claim 1 , wherein the functional unit is a substrate layer which is flexible or at least flexible in regions. 
     
     
         3 . The apparatus according to  claim 1 , wherein the at least one electronic component is an integrated circuit. 
     
     
         4 . The apparatus according to  claim 1 , wherein a plurality of active or passive electronic components are connected within one layer of the functional unit and are electrically conductive with each other. 
     
     
         5 . The apparatus according to  claim 1 , wherein the functional unit has a plurality of layers, at least one active or passive electronic component being disposed in each layer. 
     
     
         6 . The apparatus according to  claim 1 , wherein the at least one active or passive electronic components are thinned. 
     
     
         7 . The apparatus according to  claim 1 , wherein the thickness of the at least one active or passive electrical components is one of: (i) 15 to 100 μm; (ii) 20 to 50 μm; and (iii) 15 to 20 μm. 
     
     
         8 . A method for the production of a functional unit, comprising:
 applying a sacrificial layer on a substrate carrier;   applying metallizations on the sacrificial layer at least in regions;   applying a dielectric layer whilst leaving the metallizations free in at least some regions;   providing contacts on the free regions for electrical connection to at least one active or passive electronic component;   including the at least one electronic component in a further dielectric layer whilst leaving the electrical contacts free; and   removing the sacrificial layer.