Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator

Abstract

A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.

1 . A method for manufacturing a communication device including:
 forming a sealing structure including a case and a lid;   forming an IC part;   forming a printed circuit, wherein
 the IC part has an input terminal to which a signal for rewriting data of a memory of the IC part is inputted, and 
 the lid has a metal surface; 
   fixing the case and the IC part on the printed circuit;   inputting the signal to the input terminal; and   rewriting the data of the memory of the IC part.   
   
   
       2 . The method for manufacturing a communication device according to  claim 1 , wherein the communication device further includes a piezoelectric resonator having a structure in which a piezoelectric vibrating element is sealed by the case and the lid. 
   
   
       3 . The method for manufacturing a communication device according to  claim 1 , wherein the IC part has a structure to provide at least one input terminal. 
   
   
       4 . The method for manufacturing a communication device according to  claim 2 , wherein information relating to electric characteristics of the piezoelectric resonator is stored in the piezoelectric resonator. 
   
   
       5 . The method for manufacturing a communication device according to  claim 4 , further comprising reading the stored information prior to a step of rewriting the data in the memory of the IC part. 
   
   
       6 . The method for manufacturing a communication device according to  claim 4 , wherein the information relating to the electric characteristics of the piezoelectric resonator is stored in the lid.