Heat sink memory chip

Abstract

A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is in contact between the two heat conducting members so that the heat generated from the chip is contacted to the heat conducting members and the fins and escapes to the air.

1 . A heat sink for chips, comprising:
 two heat dispensing units and each heat dispensing unit including multiple fins, passages defined between the multiple fins, a flat surface defined in an inside of each heat dispensing unit and a heat conducting member connected to the flat surface of each heat dispensing unit, the chip being in contact between the two heat conducting members.   
   
   
       2 . The heat sink as claimed in  claim 1 , wherein a clamp secures the fins and the fins are parallel to each other.