Thermal Control Via Adjustable Thermal Links

Abstract

An apparatus for thermal control includes a first component; a second component; an adjustable thermal link disposed between the first component and the second component; and a controller for selectively varying a thermal conductance of the adjustable thermal link. A method of controlling a temperature includes sensing a temperature of a first component; and adjusting a thermal conductance of an adjustable thermal link, the adjustable thermal link forming a thermal path between the first component and a second component; the thermal conductance of the adjustable thermal link being adjusted such that the temperature of the first component is controlled.

1 . An apparatus for thermal control comprising:
 a first component;   a second component;   an adjustable thermal link disposed between said first component and said second component; and   a controller for selectively varying a thermal conductance of said adjustable thermal link.   
   
   
       2 . The apparatus of  claim 1 , wherein said adjustable thermal link comprises particles within a compliant matrix. 
   
   
       3 . The apparatus of  claim 2 , wherein said adjustable thermal link comprises anisotropic particles suspended within a fluidic matrix. 
   
   
       4 . The apparatus of  claim 1 , wherein said adjustable thermal link comprises alternating spacers and pliable layers, said spacers have a substantially higher thermal conductivity than said pliable layers, said spacers comprising a primary thermal path when said adjustable thermal link is compressed. 
   
   
       5 . The apparatus of  claim 1 , wherein said controller comprises a piezoelectrically active element. 
   
   
       6 . The apparatus of  claim 1 , wherein said controller comprises a micro-electrical mechanical mechanism. 
   
   
       7 . The apparatus of  claim 1 , wherein said controller applies an electrical field or magnetic field across said adjustable thermal link. 
   
   
       8 . The apparatus of  claim 1 , wherein said controller comprises two capacitive plates. 
   
   
       9 . The apparatus of  claim 1  wherein said controller comprises a shape memory alloy. 
   
   
       10 . The apparatus of  claim 1  wherein said controller selectively adjusts a dimension of said adjustable thermal link such that said thermal conductance of said thermal link is altered. 
   
   
       11 . The apparatus of  claim 10 , wherein compressing said adjustable thermal link results in said thermal link having an increased thermal conductance in at least one dimension. 
   
   
       12 . An apparatus for thermal control comprising:
 a ring resonator;   a second component, said second component being a sub-chip level electronic element;   an adjustable thermal link between said ring resonator and said second component, said adjustable thermal link comprising a compressible matrix with embedded particles; and   a piezoelectrically active element; said piezoelectrically active element altering dimensions in proportion to a bias voltage applied across said piezoelectrically active element, said piezoelectrically active element adjusting a dimension of said adjustable thermal link such that thermal contact between said embedded particles increases and thermal contact between said embedded particles and surfaces of said ring resonator and said second component increases, thereby increasing a thermal conductance of said adjustable thermal link and controlling an amount of thermal energy passing between said ring resonator and said second component.   
   
   
       13 . A method of controlling a temperature comprising:
 sensing a temperature of a first component; and   adjusting a thermal conductance of an adjustable thermal link, said adjustable thermal link forming a thermal path between said first component and a second component; said thermal conductance of said adjustable thermal link being adjusted such that said temperature of said first component is controlled.   
   
   
       14 . The method of  claim 13 , further comprising:
 quantifying a desired shift in temperature of said first component;   calculating an electrical input;   applying said electrical input to an actuation means, said actuating means being configured to alter a dimension of said adjustable thermal link such that a thermal conductance of said adjustable thermal link is adjusted.   
   
   
       15 . The method of  claim 14 , wherein:
 said actuation means comprises a piezoelectrically active layer, said electrical input comprising a voltage applied across said piezoelectrically active layer such that said piezoelectrically active layer compresses said adjustable thermal link; and   said adjustable thermal link comprises a compressible matrix with embedded particles.