Heat dissipating device and heat conduction structure thereof

Abstract

The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The walls connect to a bottom surface of the first heat conduction plate. A receiving space is defined between the first heat conduction plate and the second heat conduction plate. At least one heat pipe is arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate. Each heat pipe has a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section. A plurality of heat dissipating passages is defined between the at least one heat pipe and the walls. The heat emitting sections are partially positioned in the heat dissipating passages. The heat conduction structure can combine with a heat dissipating body and a fan to a heat dissipating device.

1 . A heat conduction structure comprises:
 a first heat conduction plate;   a second heat conduction plate positioned below the first heat conduction plate, a pair of walls extending from two opposite edges of the second heat conduction plate, the walls connecting to a bottom surface of the first heat conduction plate, a receiving space being defined between the first heat conduction plate and the second heat conduction plate; and   at least one heat pipe arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate, each heat pipe having a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section, a plurality of heat dissipating passages being defined between the at least one heat pipe and the walls, the heat emitting sections being partially positioned in the heat dissipating passages.   
   
   
       2 . The heat conduction structure as claimed in  claim 1 , wherein the first heat conduction plate and the second heat conduction plate both have a rectangle configuration. 
   
   
       3 . The heat conduction structure as claimed in  claim 1 , wherein two first through holes are defined in opposite corners of the first heat conduction plate, two second through holes are defined in the second heat conduction plate corresponding to the two first through holes, and the first through holes and the second through holes are adapted to receive a plurality of fasteners. 
   
   
       4 . The heat conduction structure as claimed in  claim 1 , wherein the at least one heat pipes comprises three heat pipes. 
   
   
       5 . The heat conduction structure as claimed in  claim 1 , wherein the at least one heat pipe has a wave-shaped and tabular configuration. 
   
   
       6 . The heat conduction structure as claimed in  claim 1 , wherein the at least one heat pipe has an “I”-shaped and tabular configuration. 
   
   
       7 . A heat dissipating device comprising:
 a heat conduction structure comprising
 a first heat conduction plate; 
 a second heat conduction plate positioned below the first heat conduction plate, a pair of walls extending from two opposite edges of the second heat conduction plate, the walls connecting to a bottom surface of the first heat conduction plate, a receiving space being defined between the first heat conduction plate and the second heat conduction plate; and 
 at least one heat pipe arranged in the receiving space and sandwiched between the first heat conduction plate and the second heat conduction plate, each heat pipe having a heat absorbing section and a plurality of heat emitting sections extending from each heat absorbing section, a plurality of heat dissipating passages being defined between the at least one heat pipe and the walls, the heat emitting sections being partially positioned in the heat dissipating passages; 
   a heat dissipating body connecting to a top surface of the first heat conduction plate; and   a fan disposed at a lateral surface of the heat conduction structure and connected thereto.   
   
   
       8 . The heat dissipating device as claimed in claimed  7 , wherein the first heat conduction plate and the second heat conduction plate both have a rectangle configuration. 
   
   
       9 . The heat dissipating device as claimed in claimed  7 , wherein two first through holes are defined in opposite corners of the first heat conduction plate, two second through holes are defined in the second heat conduction plate corresponding to the two first through holes, and the first through holes and the second through holes are adapted to receive a plurality of fasteners. 
   
   
       10 . The heat dissipating device as claimed in claimed  7 , wherein the at least one heat pipes comprises three heat pipes. 
   
   
       11 . The heat dissipating device as claimed in claimed  7 , wherein the at least one heat pipe has a wave-shaped and tabular configuration. 
   
   
       12 . The heat dissipating device as claimed in claimed  7 , wherein the at least one heat pipe has an “I”-shaped and tabular configuration.