Temperature Managing For Electronic Components

Abstract

A method and arrangement for managing the temperature of an electronic component. A reservoir holds a tempering liquid. A pressurizing device pressurizes the liquid, and provides the liquid to a spraying device, which sprays the liquid onto the electronic component. A heat remover cools the liquid when thermal energy is to be removed from the component, and a heating device heats the liquid when thermal energy is to be provided to the component when powering up the component in low temperatures.

1 - 11 . (canceled) 
   
   
       12 . An arrangement for managing a temperature of an electronic component, said arrangement comprising:
 a reservoir for holding a tempering liquid;   a pressurizing device connected to the reservoir for pressurizing the tempering liquid;   a spraying device for receiving the pressurized liquid from the reservoir and spraying the liquid onto the electronic component so as to create a thermal coupling between the sprayed liquid and the component;   a heat remover for cooling the tempering liquid when thermal energy is to be removed from the component, wherein the tempering liquid is in at least one of a liquid, a vapor, or a mist form after spraying; and   a heating device in the reservoir for heating the tempering liquid before spraying when thermal energy is to be provided to the component when powering up the component in low temperatures.   
   
   
       13 . The temperature managing arrangement according to  claim 12 , wherein the spraying device sprays the liquid at a temperature and in a form which causes thermal energy to be removed from the component according to a two-phase cooling. 
   
   
       14 . The temperature managing arrangement according to  claim 12 , wherein the tempering liquid is an electrically insulating fluid. 
   
   
       15 . The temperature managing arrangement according to  claim 12 , wherein the heating device heats the tempering liquid to a temperature approximately at the middle of a temperature range specified by a manufacturer for the electronic component to be provided with thermal energy. 
   
   
       16 . The temperature managing arrangement according to  claim 12 , wherein the spraying device sprays the tempering liquid on a cooling flange or a cooling surface thermally coupled to the electronic component to be heated or cooled by the liquid. 
   
   
       17 . The temperature managing arrangement according to  claim 12 , wherein the spraying device sprays the tempering liquid on an electronic component in the form of a circuit board or a rack provided with a plurality of circuit boards. 
   
   
       18 . The temperature managing arrangement according to  claim 12 , wherein the spraying device includes a first spraying device type for use when the temperature managing arrangement operates as a cooling arrangement and a second spraying device type for use when the temperature managing arrangement operates as a heating arrangement. 
   
   
       19 . A method of managing a temperature of an electronic component, said method comprising the steps of:
 holding a tempering liquid in a reservoir;   pressurizing the tempering liquid utilizing a pressurizing device connected to the reservoir;   providing the pressurized liquid from the reservoir to a spraying device;   spraying the liquid onto the electronic component so as to create a thermal coupling between the sprayed liquid and the component;   cooling the tempering liquid utilizing a heat remover when thermal energy is to be removed from the component, wherein the tempering liquid is in at least one of a liquid, a vapor, or a mist form after spraying; and   heating the tempering liquid before spraying utilizing a heating device in the reservoir when thermal energy is to be provided to the component when powering up the component in low temperatures.   
   
   
       20 . The method according to  claim 19 , wherein the step of heating the tempering liquid includes heating the tempering liquid to a temperature approximately at the middle of a temperature range specified by a manufacturer for the electronic component to be heated. 
   
   
       21 . The method according to  claim 19 , wherein the step of spraying the liquid onto the electronic component includes spraying the tempering liquid on a cooling flange or a cooling surface thermally coupled to the electronic component to be heated or cooled by the liquid. 
   
   
       22 . The method according to  claim 19 , wherein the step of spraying the liquid onto the electronic component includes spraying the tempering liquid on an electronic component in the form of a circuit board or a rack provided with a plurality of circuit boards.