US2009288780A1PendingUtilityA1
Perforated support plate
Est. expiryDec 28, 2026(~0.4 yrs left)· nominal 20-yr term from priority
H10P 72/0442H10P 72/7616H10P 90/00Y10T29/49998Y10T156/1798Y10T156/1062
52
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Claims
Abstract
To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.
Claims
exact text as granted — not AI-modified1 . A perforated support plate for supporting a surface of a wafer by interposing an adhesive layer, comprising
a reinforcing part for deflection prevention.
2 . The perforated support plate according to claim 1 , wherein
the reinforcing part for deflection prevention is a no-hole area for deflection prevention that is formed on a plate base material and configured with a line of a geometric pattern.
3 . The perforated support plate according to claim 2 , wherein
the geometric pattern is configured with a plurality of concentric circles, lines extending radially, or a repetition of a same graphic.
4 . The perforated support plate according to claim 2 , wherein
a line width of the geometric pattern is 1 mm or less.
5 . The perforated support plate according to claim 1 , comprising
an unopened area for suction.
6 . The perforated support plate according to claim 1 , which is approximately 300 mm in diameter and 0.7 mm or less in thickness.
7 . The perforated support plate according to claim 3 , wherein
a line width of the geometric pattern is 1 mm or less.Join the waitlist — get patent alerts
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