Heat dispensing unit for memory chip

Abstract

A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates.

1 . A heat dispensing unit comprising:
 two heat dispensing plates and each having a plurality of bending plates which split from an inside of each of the heat dispensing plates, each bending plate having a first insertion and a first hole, the first insertions on one of the two heat dispensing plates being engaged with the first holes of the other heat dispending plate, and   a memory chip clamped between the two heat dispensing plates.   
   
   
       2 . The heat dispensing unit as claimed in  claim 1 , wherein the first insertions are formed by splitting material from the bending plates and define the first holes. 
   
   
       3 . The heat dispensing unit as claimed in  claim 1 , wherein each heat dispending plate includes a heat conductive pad attached to the inside thereof. 
   
   
       4 . The heat dispensing unit as claimed in  claim 1 , wherein each heat dispensing plate includes a flange being from a top thereof so as to cover a gap between the two heat dispensing plates. 
   
   
       5 . The heat dispensing unit as claimed in  claim 4 , wherein each of the flanges includes a second insertion and a second hole.