US2009297391A1PendingUtilityA1
Manufacturing method for a silver alloy bonding wire and products thereof
Est. expiryMay 28, 2028(~1.9 yrs left)· nominal 20-yr term from priority
Inventors:Jun-Der Lee
H10W 72/01565H10W 72/552H10W 72/015C22C 5/06B22D 11/005C22C 5/08
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Claims
Abstract
A manufacturing method for a silver alloy bonding wire and products thereof A primary material of Ag is melted in a vacuum melting furnace, and then a plurality of secondary metal materials are added into the vacuum melting furnace and co-melted with the primary material to obtain a silver alloy ingot. The obtained silver alloy ingot is drawn to obtain a silver alloy wire. The silver alloy wire is then drawn to obtain a silver alloy bonding wire with a predetermined diameter.
Claims
exact text as granted — not AI-modified1 . A manufacturing method for a silver alloy bonding wire, comprising:
a) providing a primary material of Ag; b) melting the primary material in a vacuum melting furnace, adding a plurality of secondary metal materials of Au and Cu into the vacuum melting furnace and co-melting with the primary material in the vacuum melting furnace to obtain a silver alloy ingot; c) drawing the silver alloy ingot to obtain a silver alloy wire; and d) drawing the silver alloy wire to obtain a silver alloy bonding wire with a predetermined diameter.
2 . The manufacturing method according to claim 1 , wherein the weight percent of Ag in step a) is 90.00%˜99.99%.
3 . The manufacturing method according to claim 2 , wherein the weight percent of Au in step b) is 0.0001%˜9.9997%.
4 . The manufacturing method according to claim 3 , wherein the weight percent of Cu in step b) is 0.0001%˜9.9997%.
5 . The manufacturing method according to claim 4 , wherein a plurality of trace metal materials of Be and Al are added into the vacuum melting furnace and co-melted in step b).
6 . The manufacturing method according to claim 5 , wherein the weight percent of Be in step b) is 0.0001%˜9.9997%.
7 . The manufacturing method according to claim 6 , wherein the weight percent of Al in step b) is 0.0001%˜9.9997%.
8 . The manufacturing method according to claim 7 , wherein the surface of the silver alloy bonding wire is cleaned and is annealed after step d).
9 . A silver alloy bonding wire, comprising:
90.00-99.99 wt. % Ag; 0.0001˜9.9997 wt. % Au; and 0.0001˜9.9997 wt. % Cu.
10 . The silver alloy bonding wire according to claim 9 , further comprises 0.0001%˜9.9997% wt. Be.
11 . The silver alloy bonding wire according to claim 10 , further comprises 0.0001%˜9.9997% wt. Al.Join the waitlist — get patent alerts
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