Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface Area

Abstract

An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers and an integrated-circuit (IC) device mounted on to the upper surface of the flex capacitor circuit and electrically connected to the flex capacitor circuit. The flex capacitor circuit is configured to provide bypass capacitance and, therefore, adds capacitance to the IC device when the IC device is mounted on the flex capacitor circuit.

1 . A method for adding capacitance while conserving circuit board surface area, comprising:
 obtaining a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers, wherein the flex capacitor circuit is configured to provide bypass capacitance;   mounting an IC device on the upper surface of the flex capacitor circuit, wherein an electrical interconnection between the IC device and the flex capacitor circuit is created; and   mounting the flex capacitor circuit on a circuit board, wherein an electrical interconnection between the IC device and the circuit board through the flex capacitor circuit is created and capacitance is added to the IC device by the flex capacitor circuit.   
   
   
       2 . The method of  claim 1 , wherein mounting an IC device includes:
 disposing a bonding material on selected areas of the upper surface of the flex capacitor circuit; and   placing the IC device onto the upper surface of the flex capacitor circuit, wherein a bonding contact between the upper surface and the IC device is created.   
   
   
       3 . The method of  claim 1  further comprising folding a portion of the flex capacitor circuit around the IC device. 
   
   
       4 . The method of  claim 3  further comprising disposing a bonding material on selected areas of an upper surface of the IC device, wherein a bonding contact between the upper surface of the IC device and the folded portion of the flex capacitor circuit is created. 
   
   
       5 . The method of  claim 3  further comprising mounting one or more capacitors onto the folded portion of the flex capacitor circuit. 
   
   
       6 . The method of  claim 3  further comprising mounting one or more slugs onto the folded portion of the flex capacitor circuit.