Methods for Manufacturing a Panel of Electronic Component Protection Devices

Abstract

Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

1 - 54 . (canceled) 
   
   
       55 . A method manufacturing a panel of electronic component protection devices comprising:
 coating a first electrode layer with a liquid polymer formulation having a characteristic viscosity;   aligning the first electrode layer with a second electrode layer; and   bonding the first and second electrode layers to each other such that the liquid polymer formulation is interspersed between said first and second electrode layers thereby forming a panel from which a plurality of polymer-based protection devices can be obtained.   
   
   
       56 . The method of  claim 55  wherein said coating is preceded by forming a desired pattern on said first electrode layer, said pattern corresponding to a profile of the plurality of polymer-based protection devices. 
   
   
       57 . The method of  claim 55  wherein the bonding is preceded by allowing the liquid polymer formulation to dry and achieve a partial cure. 
   
   
       58 . The method of  claim 55  further comprising forming a desired pattern on said first panel, said pattern corresponding to a profile of the plurality of polymer-based protection devices. 
   
   
       59 . The method of  claim 58  wherein said pattern is formed using printed circuit board (PCB) manufacturing processes. 
   
   
       60 . The method of  claim 59  wherein said pattern is formed by:
 depositing a layer of photo-resist to either one of said first electrode layer or said second electrode layer;   applying a photo image layer on top of said layer of photo-resist, said image layer containing the pattern for the plurality of polymer-based protection devices; and   imaging, developing, and photo etching the pattern to create an outline of said polymer-based protection devices on said panel.   
   
   
       61 . The method of  claim 60  further comprising removing remaining photo-resist from the electrode layer on which it was deposited. 
   
   
       62 . The method of  claim 55  wherein the liquid polymer formulation further comprises at least one of: a thermoset material, a thermoplastic, a polyethylene material, liquid crystal material, and an acrylate material. 
   
   
       63 . The method of  claim 55  wherein said liquid polymer formulation further comprises at least one of a conductive material, an insulative material, and an antioxidant material. 
   
   
       64 . The method of  claim 55  wherein the characteristic viscosity of the liquid polymer formulation allows it to be spread on a surface to achieve a substantially uniform coat across the surface. 
   
   
       65 . The method of  claim 56  wherein the characteristic viscosity of the liquid polymer formulation allows it to be drawn evenly when processed through at least one of a coating machine, a screen printer, and a laminator.