Constant temperature gas/liquid mixture generating system for use in wafer drying process

Abstract

A constant temperature gas/liquid mixture generating system for using in wafer drying process includes: an interior tank; a first liquid supplying device for supplying liquid IPA to the interior tank; a gas supplying device for supplying nitrogen to the interior tank; an exhausting device for exhausting IPA and nitrogen mixture from said constant temperature gas/liquid mixture generating system; an exterior tank, surrounding the interior tank; a second liquid supplying device for supplying a second liquid to the exterior tank; a temperature control device for controlling the second liquid to be within a desired temperature range; and a draining device for draining the second liquid out of the exterior tank.

1 . A constant temperature gas/liquid mixture generating system for use in wafer drying process, comprising:
 an interior tank;   a first liquid supplying device, for supplying a first liquid into said interior tank;   a gas supplying device, for supplying a gas into said interior tank, wherein said gas is mixed with said first liquid in said interior tank to form a gas/liquid mixture;   an exhausting device, for exhausting said gas/liquid mixture from said constant temperature gas/liquid mixture generating system;   an exterior tank, surrounding said interior tank;   a second liquid supplying device, for supplying a second liquid into said exterior tank, wherein said second liquid contacts and surrounds the interior tank;   a temperature control device, for controlling a temperature of said second liquid at a predetermined temperature range; and   a draining device, for draining said second liquid out of said exterior tank.   
   
   
       2 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said gas supplying device further comprises:
 a gas inlet; and   a bottom gas injection device, connected to said gas inlet for injecting said gas from a bottom of said interior tank toward a top of said interior tank.   
   
   
       3 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 2 , wherein said bottom gas ejecting device comprises at least one gas injection hole. 
   
   
       4 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 2 , wherein said bottom gas ejecting device is substantially disposed on a bottom of said interior tank. 
   
   
       5 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said gas supplying device supplies nitrogen (N 2 ). 
   
   
       6 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said first liquid comprises a liquid isopropyl alcohol (IPA). 
   
   
       7 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , further comprising a liquid level detecting device disposed in said interior tank. 
   
   
       8 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 7 , wherein said liquid level detecting device may be a floating type. 
   
   
       9 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein temperature of said second liquid in said exterior tank is higher than room temperature. 
   
   
       10 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said predetermined temperature range is within 45° C. to 80° C. 
   
   
       11 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said second liquid comprises processed industrial water. 
   
   
       12 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , further comprising a temperature measuring device for measuring temperature of said second liquid. 
   
   
       13 . A constant temperature gas/liquid mixture generating system for use in wafer drying process according to  claim 1 , wherein said exterior tank further comprises a partitioning plate for defining a flow path of said second liquid. 
   
   
       14 . A system for use in wafer drying process, comprising:
 a liquid tank, for storing a first liquid;   a gas tank, for storing a gas;   a constant temperature gas/liquid mixture generating device, comprising:
 an interior tank, for receiving and mixing said first liquid stored in said liquid tank via a liquid supplying device and said gas stored in said gas tank via gas supplying device to form a gas/liquid mixture; 
 an exterior tank, surrounding said interior tank; 
 a second liquid supplying device, for supplying a second liquid into said exterior tank, wherein said second liquid surrounds said interior tank; 
 a temperature control device, for controlling a temperature of said second liquid within a predetermined temperature range; and 
   a wafer drying device, connected to said interior tank for receiving heated gas/liquid mixture for drying a wafer.   
   
   
       15 . A system for using in wafer drying process according to  claim 14 , further comprising an exhausting device for exhausting said gas/liquid mixture from said constant temperature gas/liquid mixture generating system. 
   
   
       16 . A system for using in wafer drying process according to  claim 14 , further comprising a draining device for draining said second liquid out of said exterior tank. 
   
   
       17 . A system for using in wafer drying process according to  claim 14 , wherein said first liquid comprises a liquid isopropyl alcohol (IPA). 
   
   
       18 . A system for using in wafer drying process according to  claim 14 , wherein said gas comprises nitrogen (N 2 ). 
   
   
       19 . A system for using in wafer drying process according to  claim 14 , wherein said wafer drying device comprises comprising a wafer drying chamber. 
   
   
       20 . A system for using in wafer drying process according to  claim 19 , further comprising a gas transporting device for transporting said gas/liquid mixture from said constant temperature gas/liquid mixture generating device to said wafer drying chamber. 
   
   
       21 . A system for using in wafer drying process according to  claim 20 , wherein said wafer drying chamber comprises at least one nozzle port connected to said gas transporting device for supplying said gas/liquid mixture to said wafer drying chamber to dry wafer. 
   
   
       22 . A system for using in wafer drying process according to  claim 14 , wherein said predetermined temperature is higher than room temperature.