System and method for reducing temperature variation during burn in

Abstract

Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

1 . A method of determining a junction temperature of an integrated circuit, said method comprising:
 measuring an ambient temperature in a region proximate to said integrated circuit;   measuring electrical power utilized by said integrated circuit;   accessing a thermal resistance value for said integrated circuit, wherein said thermal resistance value is dependent on packaging of said integrated circuit; and   determining a junction temperature of said integrated circuit by using at least said measured ambient temperature, said measured power, and said thermal resistance value.   
   
   
       2 . The method of  claim 1  wherein said determining comprises multiplying said thermal resistance value by said measured electrical power and adding said measured ambient temperature. 
   
   
       3 . The method of  claim 1  wherein said measuring electrical power comprises measuring current supplied to said integrated circuit. 
   
   
       4 . The method of  claim 1  wherein said measuring electrical power comprises measuring voltage supplied to said integrated circuit. 
   
   
       5 . The method of  claim 1  wherein said thermal resistance value is accessed from a computer usable media.