Polishing pad and polishing device

Abstract

The present invention provides a polishing pad with a pressure sensor and the polishing apparatus thereof. The polishing pad is used in the polishing process of semiconductor and other work piece, which includes at least one substrate, at least one pressure sensor and at least one signal transmitting module. The substrate has a polishing face, a bottom face opposite to the polishing face, and at least one cavity set on the bottom face of the substrate. The pressure sensor is set in the cavity and configured for providing a pressure signal. The signal transmitting module is set on the polishing pad and configured for transmitting a pressure signal. The pressure signal is a loading pressure value and/or loading pressure distribution on the polishing pad with a preset range. Thus, with the pressure signal, the polishing apparatus prevents the concerned work piece from being over polished to further improve polishing quality and yield.

1 . A polishing pad, applied to a polishing process of semiconductor or other work piece, said polishing pad comprising:
 at least one substrate comprising a polishing face, a bottom face opposite to said polishing face, and at least one cavity set on said bottom face;   at least one pressure sensor set in said cavity and configured for providing a pressure signal; and   at least one signal transmitting module configured for transmitting said pressure signal.   
     
     
         2 . The polishing pad according to  claim 1 , wherein said pressure signal from pressure sensor comprises a loading pressure value within a preset range. 
     
     
         3 . The polishing pad according to  claim 1 , wherein said pressure signal from pressure sensor comprises a loading pressure distribution within a preset range. 
     
     
         4 . The polishing pad according to  claim 1 , wherein said signal transmitting module comprises a print circuit board. 
     
     
         5 . The polishing pad according to  claim 1 , wherein said signal transmitting module comprises at least one conductive line. 
     
     
         6 . The polishing pad according to  claim 1 , wherein said signal transmitting module comprises a battery of power supply. 
     
     
         7 . The polishing pad according to  claim 1 , wherein said signal transmitting module comprises a wireless signal emitter. 
     
     
         8 . The polishing pad according to  claim 1 , wherein said pressure sensor and said signal transmitting module are integrated into a whole module which comprises a chip, a controller, a wireless signal emitter and a power device. 
     
     
         9 . The polishing pad according to  claim 1 , wherein there are two said substrates and said pressure sensor sandwiched between said two substrates. 
     
     
         10 . A polishing apparatus, configured for polishing a work piece and loading a polishing pad, wherein said polishing pad comprises a substrate, at least one pressure sensor and at least one first signal transmitting module; wherein said substrate comprises a polishing face, a bottom face opposite to said polishing face and a cavity set on said bottom face, and said pressure sensor is set in said cavity and configured for providing a pressure signal, and said first signal transmitting module is set on said polishing pad and configured for transmitting said pressure signal; said polishing apparatus comprising:
 a first platform, configured for loading said polishing pad and coupling said bottom face of said polishing pad;   a driving device, configured for driving said first platform to rotate;   a second platform, configured for loading said work piece;   a pressing device, configured for providing a pressure loaded between said polishing pad of said first platform and said work piece of said second platform;   at least one signal receiving module, configured for receiving said pressure signal provided by said polishing pad; and   a display device, configured for displaying said pressure signal.   
     
     
         11 . The polishing apparatus of  claim 10 , wherein said polishing pad is sealed with an adhesive and fixed on said first platform. 
     
     
         12 . The polishing apparatus of  claim 11 , wherein said adhesive is a pressure-sensitive adhesive. 
     
     
         13 . The polishing apparatus of  claim 10 , wherein said pressure signal from pressure sensor comprises a loading pressure value on said polishing pad within a preset range. 
     
     
         14 . The polishing apparatus of  claim 10 , wherein said pressure signal from pressure sensor comprises a loading pressure distribution on said polishing pad within a preset range. 
     
     
         15 . The polishing apparatus of  claim 10 , further comprising an alarm device configured for emitting an alarm signal on condition of said pressure signal out of said present range. 
     
     
         16 . The polishing apparatus of  claim 15 , wherein said alarm device emits said alarm signal to stop said polishing apparatus. 
     
     
         17 . The polishing apparatus of  claim 10 , further comprising a second signal transmitting module configured for coupling with said first signal transmitting module of said polishing pad and said signal receiving module of said polishing apparatus. 
     
     
         18 . The polishing apparatus of  claim 17 , wherein said second signal transmitting module comprises a print circuit board, a conductive line or a connector. 
     
     
         19 . The polishing apparatus of  claim 17 , wherein said second signal transmitting module is set on a surface of said polishing pad attached to said first platform. 
     
     
         20 . The polishing apparatus of  claim 10 , wherein said signal receiving module comprises a wireless signal receiver.