US2009320379A1PendingUtilityA1

Chemical Mechanical Polishing Pads Comprising Liquid Organic Material Encapsulated in Polymer Shell and Methods For Producing The Same

Assignee: JUN SUNG-MINPriority: Jul 24, 2006Filed: Jul 20, 2007Published: Dec 31, 2009
Est. expiryJul 24, 2026(expired)· nominal 20-yr term from priority
H10P 52/00B24D 3/00B24D 3/32B24B 37/24
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Claims

Abstract

There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130° C. or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.

Claims

exact text as granted — not AI-modified
1 . A chemical mechanical polishing (CMP) pad comprising a core of a polymer shell encapsulating a liquid organic material having a boiling point and a decomposition point of 130° C. or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof,
 wherein the liquid organic material is at least one member selected from the group consisting of a hydrocarbon solvent and a modified hydrocarbon solvent formed of a mixture of CnHm in which n is an integer from 9 to 16; phthalate plasticizers; liquid oligomers with a molecular weight of about 10,000 or less and a viscosity of about 5×10 8  cps/20° C. or less; solvents with a high boiling point such as N,N-dimethylformamide (DMF); and the mixture thereof.   
     
     
         2 . The CMP pad of  claim 1 , wherein the polymer shell has a density of 0.5 to 1.5 g/cm 3 . 
     
     
         3 . The CMP pad of  claim 1 , wherein the polymer shell is selected from the group consisting of polystyrene-acrylate copolymer, polyacrylonitrile, polyacrylate, polycarbonate, silicone, epoxy, polyurethane, polyester, nylon, polyvinylchloride, polystyrene, polypropylene, polyethylene, acrylic resin, and the mixture thereof. 
     
     
         4 . (canceled) 
     
     
         5 . The CMP pad of  claim 1 , wherein the phthalate plasticizers are selected from the group consisting of dioctyl phthalate, diisononyl phthalate, dioctyl adipate, trioctyl trimellitate, dibutyl phthalate, and diisodecyl phthalate. 
     
     
         6 . The CMP pad of  claim 1 , wherein the liquid oligomers are selected from the group consisting of polypropylene glycol, polyethylene glycol, polymethylene glycol, ester polyol, carbonate polyol, poly Hanstoff dispersion, and polyisocyanate polyaddition. 
     
     
         7 . The CMP pad of  claim 1 , wherein the polymer matrix is selected from a the group consisting of polyurethane, polyester, nylon, acryl, epoxy, silicone, polycarbonate, and a mixtures thereof. 
     
     
         8 . The CMP pad of  claim 1 , wherein the core is contained in the polymer matrix by 1 to 200 part per hundred resin (phr). 
     
     
         9 . The CMP pad of  claim 1 , wherein the core has a size of 1 to 200 μm. 
     
     
         10 . The CMP pad of  claim 1 , wherein the pad has a hardness of 60 Shore D or greater. 
     
     
         11 . A method of producing a CMP pad, the method comprising:
 producing a polymer matrix by a two-liquid casting method using a main material and a hardener; and   mixing the polymer matrix with a core of a polymer shell encapsulating a liquid organic material having a boiling point and a decomposition point of 130° C. or greater,   wherein the liquid organic material is at least one member selected from the group consisting of a hydrocarbon solvent and a modified hydrocarbon solvent formed of a mixture of CnHm in which n is an integer from 9 to 16; phthalate plasticizers; liquid oligomers with a molecular weight of about 10,000 or less and a viscosity of about 5×10 8  cps/20° C. or less; solvents with a high boiling point such as N,N-dimethylformamide (DMF); and mixtures thereof.   
     
     
         12 . The method of  claim 11 , wherein the core of the polymer shell encapsulating the liquid organic material is mixed with at least one of the main materials and the hardener. 
     
     
         13 . The method of  claim 11 , wherein the core of the polymer shell is contained in the polymer matrix by 1 to 200 phr. 
     
     
         14 . The method of  claim 11 , wherein the polymer matrix is selected from the group consisting of polyurethane, polyester, nylon, acryl, epoxy, silicone, polycarbonate, and a mixtures thereof. 
     
     
         15 . The method of  claim 11 , wherein the polymer shell has a density of 0.5 to 1.5 g/cm 3 . 
     
     
         16 . The method of  claim 11 , wherein the polymer shell is selected from the group consisting of polystyrene-acrylate copolymer, polyacrylonitrile, polyacrylate, polycarbonate, silicone, epoxy, polyurethane, polyester, nylon, polyvinylchloride, polystyrene, polypropylene, polyethylene, acrylic resin, and a mixtures thereof. 
     
     
         17 . The method of  claim 11 , wherein the phthalate plasticizer is selected from the group consisting of dioctyl phthalate, diisononyl phthalate, dioctyl adipate, trioctyl trimellitate, dibutyl phthalate, and diisodecyl phthalate. 
     
     
         18 . The method of  claim 11 , wherein the liquid oligomers are selected from the group consisting of polypropylene glycol, polyethylene glycol, polymethylene glycol, ester polyol, carbonate polyol, poly hanstoff dispersion, and polyisocyanate polyaddition.

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