Active heat sink designs

Abstract

A heat sink includes a surface and a first active element connected to the surface. The first active element is configured to move from a first position relative to the surface to a second position relative to the surface. The movement alters the heat transfer characteristics of the heat sink.

1 . A heat sink, comprising:
 a surface; and   a first active element connected to said surface and configured to move from a first position relative to said surface to a second position relative to said surface, said movement altering the heat transfer characteristics of the heat sink.   
   
   
       2 . The heat sink as recited in  claim 1 , wherein said active element is configured to move in response to a signal from a control system. 
   
   
       3 . The heat sink as recited in  claim 1 , wherein said active element is configured to move in response to a change of temperature of said active element. 
   
   
       4 . The heat sink as recited in  claim 1 , wherein said active element comprises a first layer and a second layer, said first layer having a coefficient of thermal expansion (CTE) different than a CTE of said second layer. 
   
   
       5 . The heat sink as recited in  claim 1 , wherein said active element is an active element of a micro-electrical-mechanical system (MEMS). 
   
   
       6 . The heat sink as recited in  claim 1 , further comprising a second active element, wherein said first active element and second active element are configured to form a closed channel. 
   
   
       7 . The heat sink as recited in  claim 1 , wherein said first active element is configurable to redirect flow of a cooling fluid from one portion of said heat sink to another portion of said heat sink. 
   
   
       8 . The heat sink as recited in  claim 1 , further comprising a conduit or channel configured to transport a cooling fluid from one location of said heat sink to another location of said heat sink. 
   
   
       9 . A method, comprising:
 providing a heat sink having a surface; and   forming a first active element on said surface and configuring said active element to move from a first position relative to said surface to a second position relative to said surface different from said first position, said movement altering the heat transfer characteristics of the heat sink.   
   
   
       10 . The method as recited in  claim 9 , wherein said active element is configured to move in response to a signal from a control system. 
   
   
       11 . The method as recited in  claim 9 , further comprising configuring said active element to move in response to a change of temperature of said active element. 
   
   
       12 . The method as recited in  claim 9 , wherein said active element comprises a first layer and a second layer, said first layer having a coefficient of thermal expansion (CTE) different than a CTE of said second layer. 
   
   
       13 . The method as recited in  claim 9 , wherein said active element is an active element of a micro-electrical-mechanical system (MEMS). 
   
   
       14 . The method as recited in  claim 9 , further comprising forming a second active element on said surface and configuring said first and second active elements to form a closed channel. 
   
   
       15 . The method as recited in  claim 9 , further comprising configuring said first active element to redirect flow of a cooling fluid from one portion of said heat sink to another portion of said heat sink. 
   
   
       16 . The method as recited in  claim 9 , further comprising forming a conduit or channel configured to transport a cooling fluid from one location of said heat sink to another location of said heat sink. 
   
   
       17 . A system, comprising:
 a device configured to produce heat; and   a first heat sink having a surface in thermal contact with said device and comprising an active element connected to said surface and configured to move from a first position relative to said surface to a second position relative to said surface, wherein said active element is configurable to change a direction of flow of a cooling fluid in response to said heat produced by said device.   
   
   
       18 . The system as recited in  claim 17 , further comprising a second heat sink having an active element configured to change an air flow through said first heat sink. 
   
   
       19 . The system as recited in  claim 17 , further comprising a control system configured to command movement of said active element. 
   
   
       20 . The system as recited in  claim 17 , wherein said active element is a movable element of a micro-electrical-mechanical system (MEMS). 
   
   
       21 . The system as recited in  claim 17 , wherein said active element is configured to draw fluid into an inlet at an upstream location of said heat sink and to output said fluid to an outlet downstream of said inlet.