US2009324405A1PendingUtilityA1

Method for forming corrosion-resistant plating layer and rotary machine

Assignee: MITSUBISHI HEAVY IND LTDPriority: Nov 17, 2006Filed: Nov 15, 2007Published: Dec 31, 2009
Est. expiryNov 17, 2026(~0.3 yrs left)· nominal 20-yr term from priority
F05D 2260/95F04D 29/023C23C 18/1651C23F 1/28F05D 2300/16C23C 18/1834F05D 2300/611C23C 18/32
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Claims

Abstract

An object is to provide a method for forming a superior corrosion-resistant plating layer by sealing penetrating pinholes formed in an electroless plating layer. There are provided a first plating step of performing electroless Ni—P plating on a base material ( 1 ); an etching step of etching a surface of a first plating layer ( 3 ) formed by the first plating step; and a second plating step of performing electroless Ni—P plating to form a second plating layer ( 5 ) on the first plating layer ( 3 ) processed by the etching step.

Claims

exact text as granted — not AI-modified
1 . A method for forming a corrosion-resistant plating layer in which a corrosion-resistant plating layer is formed on a base material by performing electroless nickel-based plating, comprising:
 a first plating step of performing electroless nickel-based plating on the base material;   an etching step of etching a surface of a first plating layer formed by the first plating step; and   a second plating step of performing electroless nickel-based plating to form a second plating layer on the first plating layer processed by the etching step.   
   
   
       2 . The method for forming a corrosion-resistant plating layer according to  claim 1 , wherein the etching step is performed using sulfuric acid. 
   
   
       3 . The method for forming a corrosion-resistant plating layer according to  claim 1 , wherein the thickness of the first plating layer is set to 5 μm or more. 
   
   
       4 . The method for forming a corrosion-resistant plating layer according to  claim 1 , wherein the thickness of the second plating layer is set to 10 μm or more. 
   
   
       5 . The method for forming a corrosion-resistant plating layer according to  claim 1 , wherein the first plating step and the second plating step are each performed by electroless Ni—P plating, and a P concentration of the electroless Ni—P plating is set in the range of 7 to 10 percent by weight. 
   
   
       6 . A rotary machine having a surface provided with a corrosion-resistant plating layer formed by the method for forming a corrosion-resistant plating layer according to  claim 1 .

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