Circuit board structure

Abstract

A circuit board structure including a circuit board main body and an injection molded three-dimensional circuit device encapsulating at least a portion of the circuit board main body is provided. The three-dimensional circuit device includes a molded plastic body having a non-plate type, stereo structure, on which a three-dimensional pattern is also fabricated. The three-dimensional pattern is interconnected with a contact pad on the circuit board main body through a conductive via.

1 . A circuit board structure, comprising:
 a circuit board main body; and
 an injection molded three-dimensional circuit device, encapsulating at least a portion of said circuit board main body, wherein said three-dimensional circuit device includes a molded plastic body having a non-plate type, stereo structure, on which a three-dimensional pattern is fabricated, said three-dimensional pattern is interconnected with a contact pad on said circuit board main body through a conductive via. 
   
   
   
       2 . The circuit board structure according to  claim 1 , wherein said circuit board main body includes rigid printed circuit board (rigid PCB), flexible printed circuit board (flexible PCB), rigid-flex composite printed circuit board (rigid-flex composite PCB) or rigid-flex combination printed circuit board (rigid-flex combination PCB). 
   
   
       3 . The circuit board structure according to  claim 1 , wherein said circuit board main body comprises a two-layer board or a multi-layer board. 
   
   
       4 . The circuit board structure according to  claim 1 , wherein said circuit board main body comprises a core layer. 
   
   
       5 . The circuit board structure according to  claim 1 , wherein said molded plastic body is made of plastic material comprising engineering plastic or ceramic. 
   
   
       6 . The circuit board structure according to  claim 5 , wherein said engineering plastic is selected from a group consisting of polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS copolymer), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystalline polymer (LCP), polyamide 6 (PA 6), Nylon, polyoxymethylene (POM), poly-phenylone-sulfide (PPS) and cyclic-olefin-copolymer (COC). 
   
   
       7 . The circuit board structure according to  claim 5 , wherein said engineering plastic comprises catalytic particles. 
   
   
       8 . The circuit board structure according to  claim 7 , wherein said catalytic particles comprise copper oxide particles, aluminum nitride particles or palladium particles. 
   
   
       9 . The circuit board structure according to  claim 7 , wherein said catalytic particles are selected from a group consisting of manganese, chromium, palladium, copper, aluminum and platinum. 
   
   
       10 . The circuit board structure according to  claim 1 , wherein a first side of said circuit board main body has a coplanar first pattern, a second side of said circuit board main body has a coplanar second pattern. 
   
   
       11 . The circuit board structure according to  claim 10 , wherein said first pattern is arranged in matrix and is partially covered by said molded plastic body. 
   
   
       12 . The circuit board structure according to  claim 10 , wherein an edge of said molded plastic body aligns with an edge of said first pattern. 
   
   
       13 . The circuit board structure according to  claim 1 , wherein said circuit board main body comprises a second three-dimensional pattern. 
   
   
       14 . A method of fabricating a circuit board structure, comprising:
 providing a circuit board main body;   forming a molded plastic body by encapsulating at least a portion of said circuit board main body with injection molded material; and   forming a first three-dimensional pattern on said molded plastic body thereby defining a three-dimensional circuit device.   
   
   
       15 . The method according to  claim 14 , wherein said molded plastic body is directly injected under low injected pressure or low molded temperature. 
   
   
       16 . The method according to  claim 14 , wherein said circuit board main body includes rigid printed circuit board (rigid PCB), flexible printed circuit board (flexible PCB), rigid-flex composite printed circuit board (rigid-flex composite PCB) or rigid-flex combination printed circuit board (rigid-flex combination PCB). 
   
   
       17 . The method according to  claim 14 , wherein said circuit board main body comprises a two-layer board or a multi-layer board. 
   
   
       18 . The method according to  claim 14 , wherein said circuit board main body comprises a core layer. 
   
   
       19 . The method according to  claim 14 , wherein said molded plastic body is made of plastic material comprising engineering plastic or ceramic. 
   
   
       20 . The method according to  claim 19 , wherein said engineering plastic is selected from a group consisting of polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS copolymer), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystalline polymer (LCP), polyamide 6 (PA 6), Nylon, polyoxymethylene (POM), poly-phenylone-sulfide (PPS) and cyclic-olefin-copolymer (COC). 
   
   
       21 . The method according to  claim 19 , wherein said engineering plastic comprises catalytic particles. 
   
   
       22 . The method according to  claim 21 , wherein said catalytic particles comprise copper oxide particles, aluminum nitride particles or palladium particles. 
   
   
       23 . The method according to  claim 21 , wherein said catalytic particles are selected from a group consisting of manganese, chromium, palladium, copper, aluminum and platinum. 
   
   
       24 . The method according to  claim 14 , wherein the first side of said circuit board main body has a coplanar first pattern, the second side of said circuit board main body has a coplanar second pattern. 
   
   
       25 . The method according to  claim 24 , wherein said first pattern is arranged in matrix and is partially covered by said molded plastic body. 
   
   
       26 . The method according to  claim 24 , wherein an edge of said molded plastic body aligns with an edge of said first pattern. 
   
   
       27 . The method according to  claim 14 , wherein said circuit board main body comprises a second three-dimensional pattern. 
   
   
       28 . The method according to  claim 14 , wherein said first three-dimensional pattern is formed by laser direct structuring (LDS), microscopic integrated processing technology (MIPTEC) or two-shot molding.