Process for application of a metal layer on a substrate

Abstract

The present invention relates to processes for application of a metal layer on a substrate via deposition of a metal from a metal salt solution by a chemical and/or electroplating method, a significant factor in these processes being that carbon nanotubes are present in the substrate surface. The present invention moreover relates to the use of carbon nanotubes for application of a metal layer on a substrate.

1 . A process for application of a metal layer on a substrate via deposition of a metal from a metal salt solution, which comprises the presence of carbon nanotubes in the substrate surface. 
   
   
       2 . The process according to  claim 1 , wherein the carbon nanotubes used comprise single- or multiwall carbon nanotubes whose length is in the range from 0.5 to 1000 μm and whose diameter is in the range from 0.002 to 0.5 μm. 
   
   
       3 . The process according to  claim 1 , wherein the substrate comprises a thermoplastic molding composition, where the thermoplastic molding composition comprises, based on the total weight of components A, B, C, and D, which is 100% by weight,
 a from 20 to 99% by weight of a thermoplastic polymer, as component A,   b from 1 to 30% by weight of carbon nanotubes, as component B,   c from 0 to 10% by weight of a dispersing agent, as component C, and   d from 0 to 40% by weight of fibrous or particulate fillers, or a mixture of these, as component D.   
   
   
       4 . The process according to  claim 3 , wherein the component A used comprises one or more polymers selected from the group of impact-modified vinylaromatic copolymers, polyolefins, polycarbonates, thermoplastic polyurethanes, and styrene-based thermoplastic elastomers. 
   
   
       5 . The process according to  claim 1 , wherein the substrate is provided with a dispersion, and the dispersion is at least partially dried and/or at least partially hardened and, after the at least partial drying and/or at least partial hardening of the dispersion, deposition of the metal takes place by a chemical and/or electroplating method, where the dispersion comprises 
     a′ from 0.1 to 99.9% by weight, based on the total weight of components A′, B′, and C′, of an organic binder component A′;
 b′ from 0.1 to 30% by weight, based on the total weight of components A′, B′, and C′, of carbon nanotubes, as component B′; 
 c′ from 0 to 99.8% by weight, based on the total weight of components A′, B′, and C′, of a solvent component C′. 
 
   
   
       6 . The process according to  claim 5 , wherein the dispersion moreover comprises at least one of the following components:
 d′ from 0.1 to 50% by weight, based on the total weight of components A′, B′, and C′, of a dispersing agent component D′; and also   e′ from 0.1 to 50% by weight, based on the total weight of components A′, B′, and C′, of a filler component E′.   
   
   
       7 . The process according to  claim 5 , wherein the binder component A′ is composed of a polymer or polymer mixture. 
   
   
       8 . The process according to  claim 5 , wherein the dispersion is applied in structured or non-structured form to the substrate. 
   
   
       9 . The process according to  claim 1 , wherein the substrate surface in which carbon nanotubes are present is activated prior to deposition of a metal by a chemical and/or electroplating method. 
   
   
       10 . (canceled) 
   
   
       11 . A substrate surface at least partially having an electrically conductive metal layer obtainable from the process according to  claim 1 . 
   
   
       12 . The substrate surface according to  claim 11  wherein the electrically conductive metal layer is provided for conducting electrical current or heat, or as a decorative metal surface, or for shielding from electromagnetic radiation, or else for magnetizing. 
   
   
       13 . A printed circuit board, RFID antenna, transponder antenna or other antenna structure, seat-heating system, ribbon cable, foil conductor, contactless chip card, conductor tracks in solar cells, or in LCD display screens or in plasma display screens comprising the substrate surface according to  claim 12 . 
   
   
       14 . The process according to  claim 2 , wherein the substrate comprises a thermoplastic molding composition, where the thermoplastic molding composition comprises, based on the total weight of components A, B, C, and D, which is 100% by weight,
 a from 20 to 99% by weight of a thermoplastic polymer, as component A,   b from 1 to 30% by weight of carbon nanotubes, as component B,   c from 0 to 10% by weight of a dispersing agent, as component C, and   d from 0 to 40% by weight of fibrous or particulate fillers, or a mixture of these, as component D.   
   
   
       15 . The process according to  claim 2 , wherein the substrate is provided with a dispersion, and the dispersion is at least partially dried and/or at least partially hardened and, after the at least partial drying and/or at least partial hardening of the dispersion, deposition of the metal takes place by a chemical and/or electroplating method, where the dispersion comprises
 a′ from 0.1 to 99.9% by weight, based on the total weight of components A′, B′, and C′, of an organic binder component A′;   b′ from 0.1 to 30% by weight, based on the total weight of components A′, B′, and C′, of carbon nanotubes, as component B′;   c′ from 0 to 99.8% by weight, based on the total weight of components A′, B′, and C′, of a solvent component C′.   
   
   
       16 . The process according to  claim 6 , wherein the binder component A′ is composed of a polymer or polymer mixture. 
   
   
       17 . The process according to  claim 6 , wherein the dispersion is applied in structured or non-structured form to the substrate. 
   
   
       18 . The process according to  claim 7 , wherein the dispersion is applied in structured or non-structured form to the substrate. 
   
   
       19 . The process according to  claim 2 , wherein the substrate surface in which carbon nanotubes are present is activated prior to deposition of a metal by a chemical and/or electroplating method. 
   
   
       20 . The process according to  claim 3 , wherein the substrate surface in which carbon nanotubes are present is activated prior to deposition of a metal by a chemical and/or electroplating method. 
   
   
       21 . The process according to  claim 4 , wherein the substrate surface in which carbon nanotubes are present is activated prior to deposition of a metal by a chemical and/or electroplating method.